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A bonding packaging method suitable for large-size, high-density structure metal microchannel heat sinks

A packaging method and dense structure technology, applied in the direction of semiconductor devices, electric solid devices, semiconductor/solid device components, etc., to reduce the difficulty of loading, ensure positioning accuracy, and reduce the difficulty of positioning

Active Publication Date: 2020-04-24
DALIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to solve the packaging technical problems of the above-mentioned large-size, high-density structure metal microchannel, the present invention proposes a transition layer compensation type metal microchannel bonding packaging method to solve the large-size, high-density structure microchannel heat sink Solve the problem of bonding gaps in the package, realize high-strength, gap-free, high-precision package bonding of large-scale, high-density structure micro-channel heat sinks

Method used

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  • A bonding packaging method suitable for large-size, high-density structure metal microchannel heat sinks
  • A bonding packaging method suitable for large-size, high-density structure metal microchannel heat sinks
  • A bonding packaging method suitable for large-size, high-density structure metal microchannel heat sinks

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Embodiment

[0041]The bonding package of the metal microchannel heat sink with large size and high density structure of the present invention is realized through the following tooling and process.

[0042] figure 1 , 2 It is the overall view and partial view after the assembly of the bonded board and the package fixture, mainly including: upper cover plate 1, positioning block 2, lower cover plate 3, screws 4, nuts 5, gaskets 6, spring washers 7, microchannel bottom plate 8. Encapsulation cover plate 9. The microchannel bottom plate 8 and the packaging cover plate 9 are parts to be bonded, and the positioning block 2 fixes the positions of the microchannel bottom plate 8 and the packaging cover plate 9 . The nut 5, the gasket 6, and the spring washer 7 provide elastic pre-tightening force, and clamp the microchannel bottom plate 8 and the package cover plate 9 in the package cavity formed by the upper cover plate 1, the positioning block 2 and the lower cover plate 3.

[0043] image ...

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Abstract

The invention discloses a bonding packaging method suitable for a large-size and high-density-structure metal micro-channel radiator. The boding packaging method comprises the steps that 1) a bondingpositioning groove is machined in a packaging cover plate; 2) a cover plate positioning groove and a micro-channel bottom plate positioning groove are machined in a positioning block; 3) a packaging cover plate is positioned and installed through the cover plate positioning groove in the positioning block; metal slurry is coated in a bonding positioning groove in the packaging cover plate; 4) a micro-channel bottom plate is mounted through the micro-channel bottom plate positioning groove in the positioning block and the bonding positioning groove in the packaging cover plate; and 5) elastic pre-tightening is performed on a positioned and aligned packaging body by bolts, oxygen-free high-temperature slurry molting, and cooing and bonding are carried out, and finally a large-size and intensive type metal micro-channel radiator packaging body is obtained. By virtue of the transition layer compensation type bonding packaging method, the technical bottleneck of bonding and packaging of thelarge-size and high-density-structure metal micro-channel radiator is overcome, and high-strength, non-clearance and high-precision metal micro-channel packaging are achieved.

Description

technical field [0001] The invention relates to a bonding and packaging method for a microchannel radiator, in particular to a bonding and packaging method for a metal microchannel radiator with a large size and dense structure. Background technique [0002] With the development of electronic and mechanical devices in the direction of miniaturization and miniaturization, the integration of electronic devices continues to increase, and the calorific value per unit volume of power electronic devices is increasing. People's heat dissipation requirements for such products are increasing day by day. [0003] Metal microchannels have high thermal conductivity and high specific surface area. Compared with heat dissipation methods such as air convection and liquid injection, the use of metal microchannels for liquid flow heat dissipation has shown great advantages in the heat exchange of high heat flux density electronic devices. At present, metal microchannel radiators have been w...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/367H01L23/373H01L23/473
CPCH01L23/367H01L23/3736H01L23/473
Inventor 杜立群翟科宋满仓赵雯朱和卿魏壮壮姬学超
Owner DALIAN UNIV OF TECH
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