Interface thermal resistance control method

A technology of interface thermal resistance and thermal resistance, which is applied in the thermal field to achieve the effect of thermal rectification

Active Publication Date: 2019-07-05
TSINGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in the prior art, there is no method for effectively controlling the interface thermal resistance and a thermal device with adjustable interface thermal resistance.

Method used

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Embodiment Construction

[0035] The present invention will be further described in detail below in conjunction with the drawings and specific embodiments.

[0036] See Figure 1-2 The embodiment of the present invention provides an interface thermal resistance control method, which is used to control the thermal resistance at the interface between a metallic material and a non-metallic material. The control method includes:

[0037] Step S11, providing a first thermal pole 10 and a second thermal pole 20, the first thermal pole 10 is made of metal material, the second thermal pole 20 is made of non-metallic material, and the first thermal pole The pole 10 is in close contact with the second hot pole 20 to form a thermal interface 100; and

[0038] In step S12, the thermal resistance at the thermal interface 100 is adjusted by changing the intensity (direction and / or strength) of the electric field at the thermal interface 100.

[0039] In step S11, the first hot pole 10 and the second hot pole 20 are both m...

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Abstract

The present invention provides an interface thermal resistance control method. The method is used for regulating thermal resistance at a thermal interface formed by the close contact between a first thermal pole and a second thermal pole; the first thermal pole is made of a metal material; the second thermal pole is made of a non-metallic material; and electric field strength at the thermal interface can be adjusted, so that thermal resistance at the thermal interface can be adjusted. With the method adopted, thermal rectification can be realized simply and effectively, and a possibility for further manufacturing various thermal logic devices is provided.

Description

Technical field [0001] The invention relates to the field of thermal technology, in particular to a method for adjusting and controlling interface thermal resistance. Background technique [0002] When heat flows through the interface of two solids in contact, the interface itself presents a significant thermal resistance to the heat flow, that is, interfacial thermal resistance. Thermal logic control can be achieved by adjusting the size of the interface thermal resistance, and thermal devices can be manufactured on this basis. However, in the prior art, there is not yet a method that can effectively control the interface thermal resistance and a thermal device with adjustable interface thermal resistance. Summary of the invention [0003] In view of this, it is indeed necessary to provide a method for controlling interface thermal resistance to overcome the deficiencies in the prior art. [0004] A method for adjusting and controlling interface thermal resistance is used to adju...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G05F1/46
CPCG05F1/46H05B1/0227H05B2214/04H05B3/0004H05B3/0014H05B3/40
Inventor 段正刘长洪范守善
Owner TSINGHUA UNIV
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