Mini-LED backlight component and manufacturing method thereof

A mini-led and backlight technology, applied in the field of Mini-LED backlight and its production, can solve problems such as poor splicing, and achieve the effect of improving the problem of dark lines between light panels

Active Publication Date: 2019-07-26
HUIZHOU CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Easy to cause poor splicing
Therefore, it is generally hoped that L1

Method used

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  • Mini-LED backlight component and manufacturing method thereof
  • Mini-LED backlight component and manufacturing method thereof
  • Mini-LED backlight component and manufacturing method thereof

Examples

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Embodiment Construction

[0032] see figure 2 , which is a side view of a preferred embodiment of the Mini-LED backlight of the present invention, the Mini-LED backlight mainly includes: a backplane 10 and a plurality of rectangular lamp panels 20 provided with Mini-LEDs 40 arranged in an array, so The lamp panels 20 are arranged in an array and spliced ​​on the back panel 10; there are joints between adjacent lamp panels 20, and the back panel 10 is provided with grooves corresponding to the joints, and the joints And the groove is filled with cured white glue 50.

[0033] In the present invention, a groove is designed on the back plate 10, and the non-groove part is used to fix the lamp panel 20; white glue 50 is filled in the groove, and the height of the white glue 50 should be higher than the groove, and the reflectivity of the white glue 50 is More than 90%, which is similar to the reflectivity of the current reflective sheet. White glue can use PA6T, PA9T, PCT, EMC or SMC materials. In this ...

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Abstract

The invention relates to a Mini-LED backlight component and a manufacturing method thereof. The Mini-LED backlight component comprises a backboard and a plurality of rectangular lamp panels with Mini-LEDs in array arrangement; the lamp panels are arranged on the backboard in an array arrangement manner, and a joint is arranged between every two adjacent lamp panels; the backboard is provided withgrooves corresponding to the joints; and the joints and the grooves are filled with cured white glue. The invention also provides the corresponding manufacturing method of the Mini-LED backlight component. By virtue of the Mini-LED backlight component and the manufacturing method thereof, the problem of dark lines between the lamp plates of the LED backlight component is solved

Description

technical field [0001] The invention relates to the field of display technology, in particular to a Mini-LED backlight and a manufacturing method thereof. Background technique [0002] Mini-LED (Mini-LED) is a product with a chip size below 200 microns. [0003] In the market, Mini-LED is used as the backlight source of LCD display, because it can achieve ultra-thin, multi-partition and small-size chip products at the same time, which can be comparable to OLED products in terms of actual effect, and can be more expensive than OLED in terms of material cost. proposed to be used for competitive advantage. [0004] Limited by the current printing machine, Mini-LED products are all packaged into small pieces of light panels, and then the small pieces of light panels are spliced ​​into large-size backlights. The size of a single light panel for Mini-LED backlighting is limited (currently, die bonding machines are used, and the conventional size is 300mm*300mm). When using Mini...

Claims

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Application Information

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IPC IPC(8): H01L33/48H01L25/075F21V19/00F21Y115/10
CPCF21V19/001F21Y2115/10H01L25/0753H01L33/48H01L2933/0033
Inventor 丘永元
Owner HUIZHOU CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD
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