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Substrate integrated type low passive inter-modulated waveguide flange gasket

A technology of passive intermodulation and waveguide flanges, which is applied in waveguide devices, electrical components, circuits, etc., can solve problems such as the inability to arrange metal convex units, the inability to realize electromagnetic band gap characteristics, and affect the normal transmission of electromagnetic waves, etc., to achieve Realize the effect of low passive intermodulation performance, miniaturization and thinness, and high flexibility

Active Publication Date: 2019-08-02
XIAN INSTITUE OF SPACE RADIO TECH
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  • Application Information

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Problems solved by technology

However, the device proposed in this patent is limited in low-frequency applications, because as the frequency decreases, the size of the periodic metal convex structure increases accordingly. The conventional standard waveguide flange area is limited, and a

Method used

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  • Substrate integrated type low passive inter-modulated waveguide flange gasket
  • Substrate integrated type low passive inter-modulated waveguide flange gasket
  • Substrate integrated type low passive inter-modulated waveguide flange gasket

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Embodiment Construction

[0036] The specific embodiment of the present invention is described in further detail below in conjunction with accompanying drawing:

[0037]The invention proposes a substrate-integrated low-passive-intermodulation waveguide flange gasket. By constructing a substrate-integrated double-sided periodic metal unit array, combined with an outer support structure, a double-sided gasket is formed between traditional waveguide flanges. Metal-free contact transition connection structure with air or medium gap. Determine the key structural size parameters through specific steps, obtain suitable electromagnetic band gap characteristics, ensure the normal transmission of the electromagnetic field along the waveguide, and cannot leak from the air or medium gap, and then replace the metal surface contact of the traditional waveguide flange connection, greatly eliminating the metal contact Non-linear for low passive intermodulation performance. The gasket structure proposed in the present...

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Abstract

The invention relates to a substrate integrated type low passive inter-modulated waveguide flange gasket. A substrate integrated double-side period metal unit array is constructed, an external supporting structure is combined, and thus, a double-side transitional connection structure free of metal contact is formed between traditional waveguide flanges; the key structural size is determined via specific steps, an appropriate electromagnetic forbidden band characteristic is obtained, and it is ensured that the electromagnetic field is transmitted normally along the waveguide and is not leaked;and further metal side contact of traditional waveguide flange connection is replaced, the metal contact nonlinearity is eliminated greatly, and low passive inter-modulation performance is realized. The provided gasket structure can realize low passive inter-modulated transitional connection needless of changing the original waveguide flange structure, and the gasket is made small, thin, light andhighly flexible in a substrate integration manner, and can match the size of a standard waveguide flange surface within low-frequency and high-frequency ranges. Low cost, versatility and batch production can be realized, and the gasket can be applied to different large power microwave parts, systems and test systems with low passive inter-modulation demands.

Description

technical field [0001] The invention relates to a waveguide flange gasket and belongs to the field of microwave technology. Background technique [0002] Passive Intermodulation (PIM) effect is an important interference phenomenon in communication systems, which widely exists in various high-power microwave passive components and connection structures. In order to ensure the normal operation of the communication system, it is necessary to take effective passive intermodulation suppression measures. The main mechanism of passive intermodulation is contact nonlinearity and material nonlinearity. Material nonlinearity can be avoided by choosing appropriate materials, while contact nonlinearity generally exists in various microwave passive structures. The waveguide structure is one of the most widely used structural forms in various high-power microwave systems, and the waveguide flange connection is the primary factor for passive intermodulation in the waveguide structure. Cur...

Claims

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Application Information

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IPC IPC(8): H01P1/00H01P1/06
CPCH01P1/00H01P1/06
Inventor 陈翔孙东全崔万照双龙龙贺永宁周强胡少光
Owner XIAN INSTITUE OF SPACE RADIO TECH
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