A substrate-integrated low passive intermodulation waveguide flange gasket
A passive intermodulation and waveguide flange technology, which is applied to waveguide-type devices, circuits, electrical components, etc., can solve the problems of inability to achieve electromagnetic band gap characteristics, inability to arrange metal convex body units, and difficulty in achieving small size and light weight. Achieve the effect of achieving low passive intermodulation performance, realizing small and thinning, and reducing the requirements of traditional waveguide flange surface treatment process and assembly process
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[0036] The specific embodiment of the present invention is described in further detail below in conjunction with accompanying drawing:
[0037]The invention proposes a substrate-integrated low-passive-intermodulation waveguide flange gasket. By constructing a substrate-integrated double-sided periodic metal unit array, combined with an outer support structure, a double-sided gasket is formed between traditional waveguide flanges. Metal-free contact transition connection structure with air or medium gap. Determine the key structural size parameters through specific steps, obtain suitable electromagnetic band gap characteristics, ensure the normal transmission of the electromagnetic field along the waveguide, and cannot leak from the air or medium gap, and then replace the metal surface contact of the traditional waveguide flange connection, greatly eliminating the metal contact Non-linear for low passive intermodulation performance. The gasket structure proposed in the present...
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