Non-contact low-passive intermodulation waveguide connection structure and design method thereof

Abstract

The invention discloses a non-contact low-passive intermodulation waveguide connection structure and a design method thereof. A periodic metal protruding body is designed at an outer wall of a waveguide and is used as a first connection part, a step waveguide with a matched size is designed at a tail end of another one waveguide and is used as a second connection part, the first connection part isembedded into the second connection part, and a non-contact waveguide connection structure is formed by mechanical connection. Appropriate electromagnetic forbidden band characteristic is obtained bycalculating parameters such as the size of the protruding body and internal distance of the connection structure, and suppression of electromagnetic leakage in a structural gap is achieved. In the non-contact low-passive intermodulation waveguide connection structure, the internal non-contact connection of the waveguide is achieved on the premise of no influence on electromagnetic transmission, contact non-linearity of traditional connection is eliminated, passive intermodulation effect is effectively prevented, and the requirement on material, processing and assembly technology is reduced; and meanwhile, the non-contact low-passive intermodulation waveguide connection structure has the advantages of wideband, compact structure, high tolerance and the like, and can be applied into variouslarge-power low-passive intermodulation microwave parts and test systems.

Description

technical field [0001] The invention relates to a non-contact low passive intermodulation waveguide connection structure and design method, which can be used in various high-power low passive intermodulation microwave components and test systems, and belongs to the field of microwave technology. Background technique [0002] Passive Intermodulation (PIM) effect is an important interference phenomenon in communication systems, which widely exists in various high-power microwave passive components and connection structures. The main mechanism of passive intermodulation is contact nonlinearity and material nonlinearity. Material nonlinearity can be avoided by choosing appropriate materials, while contact nonlinearity generally exists in various microwave passive structures. The waveguide structure is one of the most widely used structural forms in various high-power microwave systems, and the waveguide flange connection is the primary factor for passive intermodulation in the w...

AI Technical Summary

Problems solved by technology

In addition to the structure of the pressurized table, the high-pressure flange also needs to ensure a high enough smoothness of the contact surface and precise torque tightening, which has high requirements for processing and assembly technology, and due to the existence of contact, it is impossible to fundamentally eliminate contact nonlinearity , there is a long-term reliability problem

The dielectric film isolation method cannot be used in actual products due to reliability issues

Although the choke (choke) flange avoids part of the electrical contact, but because its main structure is a quarter-wavelength choke slot, it cannot achieve broadband performance, and the working bandwidth is narrow, which is also limited in practical applications.

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