Method for manufacturing flexible aluminum substrate based on polytetrafluoroethylene

Abstract

The invention provides a method for manufacturing a flexible aluminum substrate based on polytetrafluoroethylene. The method comprises the following steps: step 1, selecting raw materials; step 2, manufacturing an adhesive film; step 3, performing compounding; and step 4 manufacturing the flexible aluminum substrate. The method uses polytetrafluoroethylene to replace the traditional polyimide, andhas relatively low process requirements, and the finished product appearance yield is much higher than that of polyimide; at the same time, the polytetrafluoroethylene has a lower price; a small amount of high thermal conductivity inorganic particles are added in the polytetrafluoroethylene, the overall heat dissipation performance of the product is greatly improved, and at the same time the defect of large swelling and shrinkage of the polytetrafluoroethylene material itself is improved; the surface of the polytetrafluoroethylene adhesive film is subjected to the coupling agent treatment, the bonding force with a copper foil is improved, and problems that the existing aluminum substrate is poor in flexibility, brittle, and easy to break are overcome. The product has excellent heat conduction effects, and the finished product price is lower than the price of the polyimide flexible aluminum substrate, so that the product has the advantages of good bending performance, strong heat dissipation and low cost.

Description

technical field [0001] The invention belongs to a method for manufacturing a flexible aluminum substrate, in particular to a method for manufacturing a flexible aluminum substrate with polytetrafluoroethylene as a matrix. Background technique [0002] With the development of electronic products to be light, thin, small, high density and multifunctional, the assembly density and integration of components on printed boards are getting higher and higher, the power consumption is getting bigger and bigger, and the heat dissipation requirements of PCB substrates are getting higher and higher. The more urgent it is, if the heat dissipation of the substrate is not good, it will cause the components on the printed circuit board to overheat, thereby reducing the reliability of the whole machine. In this context, a high heat dissipation metal PCB substrate was born. Among them, the aluminum substrate is the most commonly used metal substrate. Aluminum-based copper-clad laminate is a...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the current structure of the traditional aluminum substrate is aluminum plate + adhesive layer + copper foil, and the traditional aluminum substrate aluminum plate and copper foil are mostly rigid materials that cannot be bent multiple times, and the adhesive layer is made of ordinary epoxy resin. Thermally conductive fillers lead to poor flexibility of traditional rigid aluminum substrates, which are brittle and easy to break, and cannot meet the performance requirements of today's electronic products such as lightness, flexibility, and bending resistance

However, the existing traditional polyimide-based flexible aluminum substrates on the market today are subject to disadvantages such as high price, complicated and unfriendly pressing process, and poor market feedback.

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