Fabricated electronic plant side span structure and construction method thereof

Abstract

The invention discloses a fabricated electronic plant side span structure and a construction method thereof. The fabricated electronic plant side span structure comprises a plurality of first prefabricated PC columns, a plurality of second prefabricated PC columns, longitudinal prefabricated rectangular PC beams, transverse prefabricated rectangular PC beams, first prefabricated Z-shaped PC beamsand second prefabricated Z-shaped PC beams. The construction method comprises the steps that first, the longitudinal prefabricated rectangular PC beams are hoisted; second, the first prefabricated PCcolumns and the second prefabricated PC columns are hoisted; third, the transverse prefabricated rectangular PC beams are hoisted; fourth, the first prefabricated Z-shaped PC beams and the second prefabricated Z-shaped PC beams are hoisted; fifth, prefabricated laminated boards are laid; sixth, first prefabricated H-shaped PC beams and second prefabricated H-shaped PC beams are hoisted; seventh, prefabricated lattice beams are hoisted; and eighth, first connection joints and second connection joints are constructed. According to the construction method, the stability of the fabricated electronic plant side span structure is improved, the construction quality of the fabricated electronic plant side span structure is ensured, and the plant construction speed of a fabricated electronic plantis increased.

Description

technical field [0001] The invention belongs to the technical field of prefabricated building construction, and in particular relates to a side-span structure of a prefabricated electronic factory building and a construction method thereof. Background technique [0002] The construction method of the electronic factory building is usually completed by pouring concrete on site. In order to quickly complete the construction of the factory building, a lot of manpower and material resources are usually invested in the construction process, and thousands of workers and tens of thousands of tons are often invested. The steel pipe frame materials and tens of thousands of square meters of formwork wood, so the construction of each electronic factory will consume a lot of social resources; at present, with the development of construction industrialization technology, especially with the development of housing industrialization, Precast concrete technology has gradually begun to accum...

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Problems solved by technology

[0002] The construction method of the electronic factory building is usually completed by pouring concrete on site. In order to quickly complete the construction of the factory building, a lot of manpower and material resources are usually invested in the construction process, and thousands of workers and tens of thousands of tons are often invested. The steel pipe frame materials and tens of thousands of square meters of formwork wood, so the construction of each electronic factory will consume a lot of social resources; at present, with the development of construction industrialization technology, especially with the development of housing industrialization, Precast concrete technology has gradually begun to accumulate and develop. Various construction companies are trying to choose precast concrete assembly construction mode as the construction method of electronic workshops with large-scale and standardized industrialization characteristics. The main support structure, however, still has the following defects in the construction process of the side span structure of the electronic factory building: 1. When the top of the steel column of the steel structure and the top of the prefabricated column are at different heights, two detachable Prefabricated components are connected. In the actual assembly process, there are problems of construction difficulty and poor assembly accuracy; 2. The side span structure of the prefabricated electronic factory building is complex. The stability of the span structure, the construction labor intensity is high, and the construction efficiency is low; therefore, a side-span structure of an assembled electronic factory building and its construction method should be provided

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