High-current fuse with high thermal conductivity substrate and manufacturing method thereof
A technology with high current and high thermal conductivity, which is applied in the manufacture of circuits, electrical components, and fuses, etc., and can solve problems such as failure to meet the requirements of high current use, small fuse thickness, overheating, etc.
Active Publication Date: 2021-04-06
俞东
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Problems solved by technology
[0004] The purpose of the present invention is to overcome the defects of the prior art, provide a high-current fuse with a high thermal conductivity substrate and its manufacturing method, and solve the problem that the existing fuse cannot meet the requirements of large fuses due to the small thickness of the fuse and the overheating of the fuse. The problem of current usage requirements
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[0076] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.
[0077] refer to figure 1 , the present invention provides a high-current fuse with a high thermal conductivity substrate and its manufacturing method, which is used to solve the problem that the current carried by the existing fuse is small, and is also used to solve the problem of the existing fuse by increasing the thickness of the fuse. When the carrying current is increased, the solder connection between the fuse and the circuit board is likely to melt and fail due to excessive temperature, which still cannot meet the needs of large flow. The fuse of the present invention utilizes the combination of the heat conduction layer and the metal layer, dissipates the heat generated by passing a large current at the metal layer through the heat conduction layer, and reduces the influence of heat on the connection between the metal layer and the cir...
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Abstract
The invention relates to a high-current fuse with a high thermal conductivity substrate and a manufacturing method thereof, comprising: a heat conduction layer; a metal layer arranged on the surface of the heat conduction layer, and the metal layer is connected to the heat conduction layer through a direct bonding process Together, the metal layer is etched to form a connection area located at both ends and a conduction area located inside and connecting the two connection areas, the thickness of the metal layer is between 0.1 mm and 0.3 mm; a tin metal layer at the conduction area and connected to the conduction area; and a dielectric covering layer covering the conduction area and covering the tin metal layer. In the present invention, the thickness of the metal layer is designed to be at the centimeter level, so that the fuse can meet the requirements of high current use. With the setting of the heat conduction layer, the heat generated at the metal layer will be dissipated outward through the heat conduction layer, avoiding the damage caused by excessive temperature. The influence of the connection ensures that the fuse can be applied to the circuit protection of high current.
Description
technical field [0001] The invention relates to the technical field of fuses, in particular to a high-current fuse with a high thermal conductivity substrate and a manufacturing method thereof. Background technique [0002] Fuse, also known as fuse, is an overcurrent protection device that uses the heat generated during overcurrent to fuse the conductive part to cut off the current and protect the safety of electrical appliances. [0003] Existing fuses are ceramic chip molded compound fuses, printed circuit board based film chip fuses, printed circuit board based fuses, and ceramic body mount chip fuses. The fuse is used as the conductive line inside, and the conductive line is fused to cut off the current when the current exceeds the set value. However, since the thickness of the fuse is generally designed to be in the order of microns, its current setting value is small, which cannot meet the requirements of high current use. And when the thickness of the fuse is design...
Claims
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IPC IPC(8): H01H85/08H01H85/47H01H69/02
CPCH01H69/02H01H85/08H01H85/47
Inventor 俞东
Owner 俞东