High-current fuse with high-heat-conduction substrate, and manufacturing method of high-current fuse
A manufacturing method and high-current technology, applied in the manufacturing of circuits, electrical components, fuses, etc., can solve problems such as overheating, fuses with small fuse thickness, and inability to meet the requirements of high-current use.
Active Publication Date: 2019-09-06
俞东
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Problems solved by technology
[0004] The purpose of the present invention is to overcome the defects of the prior art, provide a high-current fuse with a high thermal conductivity substrate and its manufacturing method, and solve the problem that the existing fuse cannot meet the requirements of large fuses due to the small thickness of the fuse and the overheating of the fuse. The problem of current usage requirements
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[0076] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.
[0077] refer to figure 1 , the present invention provides a high-current fuse with a high thermal conductivity substrate and its manufacturing method, which is used to solve the problem that the current carried by the existing fuse is small, and is also used to solve the problem of the existing fuse by increasing the thickness of the fuse. When the carrying current is increased, the solder connection between the fuse and the circuit board is likely to melt and fail due to excessive temperature, which still cannot meet the needs of large flow. The fuse of the present invention utilizes the combination of the heat conduction layer and the metal layer, dissipates the heat generated by passing a large current at the metal layer through the heat conduction layer, and reduces the influence of heat on the connection between the metal layer and the cir...
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Abstract
The invention relates to a high-current fuse with a high-heat-conduction substrate, and a manufacturing method of the high-current fuse. The high-current fuse comprises a heat conduction layer, a metal layer, a tin metal layer and a dielectric covering layer, wherein the metal layer is arranged on the surface of the heat conduction layer; the metal layer is connected with the heat conduction layerthrough a direct bonding process; the metal layer is etched to form connection regions located at the two ends and a conduction region located inside and connected with the two connection regions; the thickness of the metal layer ranges from 0.1mm to 0.3mm; the tin metal layer is arranged at the conduction region and is connected with the conduction region; and the dielectric covering layer covers the conduction region and covers the tin metal layer. According to the high-current fuse, the thickness of the metal layer is designed to be in centimeter level, so that the fuse can meet the use requirement of high current; and by combining the arrangement of the heat conduction layer, heat generated at the metal layer can be dissipated outwards through the heat conduction layer, so that the influence on the connection position due to excessively high temperature is avoided, and the fuse is ensured to be suitable for high-current circuit protection.
Description
technical field [0001] The invention relates to the technical field of fuses, in particular to a high-current fuse with a high thermal conductivity substrate and a manufacturing method thereof. Background technique [0002] Fuse, also known as fuse, is an overcurrent protection device that uses the heat generated during overcurrent to fuse the conductive part to cut off the current and protect the safety of electrical appliances. [0003] Existing fuses are ceramic chip molded compound fuses, printed circuit board based film chip fuses, printed circuit board based fuses, and ceramic body mount chip fuses. The fuse is used as the conductive line inside, and the conductive line is fused to cut off the current when the current exceeds the set value. However, since the thickness of the fuse is generally designed to be in the order of microns, its current setting value is small, which cannot meet the requirements of high current use. And when the thickness of the fuse is design...
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IPC IPC(8): H01H85/08H01H85/47H01H69/02
CPCH01H69/02H01H85/08H01H85/47
Inventor 俞东
Owner 俞东