Glass substrate cutting machine

A glass substrate and cutting machine technology, applied in glass cutting devices, glass manufacturing equipment, manufacturing tools, etc., can solve the problems of cutter wheel wear, affecting the quality of glass substrates, affecting the service life of cutting knives, etc.

Active Publication Date: 2019-09-20
WUHU TUNGHSU PHOTOELECTRIC SCI & TECHCO +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, the cutting knife directly cuts the annealed glass substrate. At this time, the cutting area of ​​the glass substrate presents a temperature distribution with low temperature at both ends and high temperature in the middle. Accumulated at the transition position between them, resulting in a large amount of glass dust attached to the surface of the glass substrate, and the attached glass dust cannot be eliminated in the subsequent cleaning and dust removal process of the glass substrate, seriously affecting the quality of the glass substrate
In addition, when the cutting knife cuts when the temperature in the cutting area is not uniform, it will also cause greater wear to the cutter wheel of the cutting knife, thus affecting the service life of the cutting knife

Method used

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  • Glass substrate cutting machine
  • Glass substrate cutting machine
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Embodiment Construction

[0039] Specific embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present disclosure, and are not intended to limit the present disclosure.

[0040] In the present disclosure, the orientation words used such as "inside and outside" refer to the inside and outside of the corresponding structure or component outline unless stated otherwise. In addition, terms such as "first", "second" and the like are used to distinguish one element from another, and do not have order or importance.

[0041] Such as Figure 1 to Figure 6 As shown, the present disclosure provides a glass substrate cutting machine, including a heating device 1 and a driving device 2, the heating device 1 is used to heat the cutting area of ​​the glass substrate 5, and the driving device 2 is used to drive the heating device 1 toward t...

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Abstract

The present disclosure relates to a glass substrate cutting machine. The glass substrate cutting machine comprises a heating device (1) and driving devices (2), the heating device (1) is used for heating the cutting zone of a glass substrate (5), and the driving devices (2) are used for driving the heating device (1) to move in a direction close to or away from the cutting zone. The driving devices (2) drive the heating device (1) to get close to or away from the glass substrate (5) to heat the cutting zone, so the overall temperature of the cutting zone keeps uniform, dust aggregation caused by uneven temperature of the cutting zone during cutting is prevented, and the dusts are avoided from adhering to the surface of the glass substrate (5), thereby the quality of the glass substrate (5) is improved, the wearing of a cutting blade (6) is reduced, and the service life of the cutting blade (6) is prolonged.

Description

technical field [0001] The present disclosure relates to the technical field of glass substrates, in particular, to a glass substrate cutting machine. Background technique [0002] In the production process of liquid crystal glass substrates, the molten glass frit is overflowed and drawn into plates, and then cut into individual pieces by a cutting machine. In the prior art, the cutting knife directly cuts the annealed glass substrate. At this time, the cutting area of ​​the glass substrate presents a temperature distribution with low temperature at both ends and high temperature in the middle. Accumulated at the transition position between them, resulting in a large amount of glass dust attached to the surface of the glass substrate, and the attached glass dust cannot be eliminated in the subsequent cleaning and dust removal process of the glass substrate, seriously affecting the quality of the glass substrate. In addition, when the cutting knife cuts when the temperature ...

Claims

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Application Information

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IPC IPC(8): C03B33/02
CPCC03B33/0207
Inventor 李青李赫然姚文龙何怀胜杨道辉刘源李冰汪曹胜李震李兆廷石志强
Owner WUHU TUNGHSU PHOTOELECTRIC SCI & TECHCO
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