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Method for solving misalignment of leds on a printed circuit board

A printed circuit board and ground alignment technology, which is applied to printed circuits, printed circuits assembled with electrical components, printed circuits, etc., can solve problems such as reaching secondary optical devices efficiently

Active Publication Date: 2022-07-08
LUMILEDS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such misalignment may result in suboptimal operating conditions, as light emitted from the LED may not reach the secondary optics optimally or efficiently

Method used

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  • Method for solving misalignment of leds on a printed circuit board
  • Method for solving misalignment of leds on a printed circuit board
  • Method for solving misalignment of leds on a printed circuit board

Examples

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Embodiment Construction

[0021] Examples of different light emitting diode ("LED") implementations will be described more fully below with reference to the accompanying drawings. These examples are not mutually exclusive and features found in one example may be combined with features found in one or more other examples to achieve additional implementations. Therefore, it is to be understood that the examples shown in the figures are provided for illustration purposes only and that they are not intended to limit the present disclosure in any way. The same numbers always refer to the same elements.

[0022] It will be understood that, although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of ...

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Abstract

The LEDs for the lighting system can be mounted on the PCB. The PCB may be provided with alignment features, such as oversized holes for connecting to a support surface. Using optical sensing of the orientation of the mounted LEDs, the space made available by the alignment features can be reduced and aligned to create modified alignment features. Modified alignment features can be created by adding modified components and aligned based on the sensed orientation of the mounted LEDs. Modifying the positioning of the components can counteract the misalignment of the LEDs with the PCB. Openings in the modified alignment features can accommodate bolts or alignment pins for attachment to a support surface. The support surface can be aligned with the secondary optics, thereby causing the LEDs to be aligned with the secondary optics, regardless of misalignment of the LEDs with respect to the PCB.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS [0002] This application claims the benefit of US Provisional Patent Application No. 62 / 437,593, filed on December 21, 2016, and US Non-Provisional Patent Application No. 15 / 849,384, filed on December 20, 2017, which are incorporated by reference as if incorporated herein by reference Exactly the same as explained in . Background technique [0003] Light emitting diodes (LEDs) are typically mounted on a printed circuit board (PCB), and the PCB is mounted on a support surface such as a heat sink or secondary optics. The PCB may typically include mounting holes or other features that enable the PCB to be aligned and mounted to a support surface. [0004] Misalignment of LEDs on a PCB can occur due to various process tolerances. Such misalignment may result in sub-optimal operating conditions, as the light emitted from the LED may not reach the secondary optics optimally or efficiently. SUMMARY OF THE INVENTION [0005] The fol...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K3/30F21S41/141
CPCH05K3/303H05K2201/09063H05K2201/10106H05K2203/166F21S41/19F21S41/153H05K1/0274F21S41/141Y02P70/50H05B45/00H05B45/30
Inventor A.梅纳特
Owner LUMILEDS