Machining method of rectangular workpiece
A technology of processed objects and processing methods, which is applied in the fields of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., and can solve problems such as troublesome positioning of the dividing line and complicated operations
Pending Publication Date: 2019-12-13
DISCO CORP
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
However, the following problems are assumed: the process of measuring the position of the planned dividing line in advance is cumbersome, and for example, when the planned dividing line is not formed at a single pitch, the work becomes very complicated.
Method used
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Embodiment Construction
[0029] Embodiments of the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. In addition, the components described below include those that can be easily conceived by those skilled in the art, and those that are substantially the same. In addition, the structures described below can be combined appropriately. In addition, various omissions, substitutions, or changes in the structure can be made without departing from the scope of the present invention.
[0030] The processing method of the rectangular workpiece according to this embodiment will be described. figure 1 It is a plan view of a package substrate which is a processing object of the method for processing a rectangular workpiece according to this embodiment. figure 2 yes figure 1 The rear view of the package substrate is shown. image 3 yes figure 1 A side view of the package substrate is show...
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Provided is a machining method of a rectangular workpiece capable of cutting a dividing predetermined line from a rear surface side without requiring complicated operations. A packaging substrate (1)is provided with a plurality of dividing predetermined lines (24) formed on the front surface and a front side machining groove (27) is formed along the dividing predetermined lined (24). The machining method of the packaging substrate comprises a through hole forming step of forming machining grooves (9) adjacent to a pair of opposite sides of the packaging substrate, so as to form a through hole(8) at each intersection of the front side machining groove (27) and the machining grooves (9); a dividing predetermined line position detecting step of capturing the through hole (8) by an imaging unit and detecting the positions of the dividing predetermined lines 24 based on the positions of the through holes (8); and a machining step of machining the packaging substrate 1 along the dividing predetermined line (24) from the back surface (2A) of the packaging substrate (2) based on the positions of the dividing predetermined lines (24).
Description
technical field [0001] The present invention relates to a method for processing a rectangular workpiece having a plurality of planned dividing lines formed on the front surface, and front side machining grooves are respectively formed along the planned dividing lines. Background technique [0002] Generally, there is known a method of processing a workpiece in which, after half-cutting the workpiece from the front side, half-cutting the same position from the back side to separate the workpiece, for example, to suppress chip flying Or chipping on the back side (for example, refer to Patent Document 1 and Patent Document 2). In this processing method, when the workpiece is a semiconductor wafer or the like, for example, an infrared (IR) camera is used to detect the front-side processing grooves formed along the planned dividing line, so that it can be processed from the back side of the workpiece. Perform processing along the planned dividing line. [0003] On the other han...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H01L21/304
CPCH01L21/3043
Inventor大室喜洋山田千悟
OwnerDISCO CORP