Photosensitive component, imaging module, intelligent terminal, method and mold for manufacturing photosensitive component

Abstract

A photosensitive component, an imaging module, an intelligent terminal, and a method and a mold for manufacturing the photosensitive component are disclosed. The photosensitive assembly includes: a circuit board, a hard board area having a rectangular shape and a soft board extension extending from the hard board area, wherein the hard board area has a pressing side and a non-pressing side, and the hard board area has a pressing side on the pressing side a pressing area; a photosensitive element mounted in the hard board area of ​​the circuit board; and a molding part formed on the hard board area, surrounding the photosensitive element and extending towards the photosensitive element and contacting the photosensitive element, the molding part has an inner surface, an outer side surface and top surface, and the molding part does not cover the pressing area of ​​the hard board area, and the top surface has a flat part; wherein, the top surface of the part of the molding part on the pressing side has a settling part, and the settling part is located between the flat part and the mold part. The outer surfaces of the molded parts are between and lower than the flat part, and the outer surface of the part of the molded part on the non-pressed side is perpendicular to the flat part.

Description

[0001] Cross References to Related Applications [0002] This application claims the priority and benefit of Chinese patent applications No. 201710712589.1 and No. 201721042380.0 filed with the State Intellectual Property Office of China on August 18, 2017, the entire contents of which are incorporated herein by reference. technical field [0003] The present disclosure relates to the technical field of imaging components and intelligent terminals, in particular, to a photosensitive component, an imaging module, a smart terminal, a method and a mold for manufacturing a photosensitive component. Background technique [0004] Molded camera module is a high-tech that is very popular in the current market. Molding replaces the general lens holder, and the photosensitive chip, connection medium and electronic components of the camera module are covered and fixed on the circuit board. , obtained good impact stability and thermal stability. At the same time, the upper surface of t...

AI Technical Summary

Problems solved by technology

On the one hand, the glue has a certain fluidity. When the lens or motor and other components are installed after the glue is applied, the glue at the bottom of the component will overflow in all directions under pressure. At the same time, the applied glue needs to form a closed ring. The upper edge of the molding part is completely flat, relying only on the beveled or vertical edge of the draft cannot accommodate a large amount of glue overflowing from the starting point of the glue, the excess glue will overflow to the side of the module and protrude outward, making the size of the module Beyond the design range, affecting installation and use

Images