Antenna packaging module and electronic equipment

An antenna and molding technology, applied in the directions of antenna support/installation device, antenna coupling, antenna grounding switch structure connection, etc., can solve problems such as application limitations of millimeter-wave packaged antenna modules

Active Publication Date: 2020-02-28
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Abstract
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Problems solved by technology

However, the application of millimeter-wave packaged antenna modules in high-isolation dual-polarization scenarios is still limited

Method used

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  • Antenna packaging module and electronic equipment
  • Antenna packaging module and electronic equipment
  • Antenna packaging module and electronic equipment

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Embodiment Construction

[0029] In order to make the purpose, technical solution and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application.

[0030] It can be understood that the terms "first", "second" and the like used in this application may be used to describe various elements herein, but these elements are not limited by these terms. These terms are only used to distinguish a first element from another element, and should not be interpreted as indicating or implying relative importance or implying the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of these features. In the description of the present application, "...

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Abstract

The invention relates to an antenna packaging module and electronic equipment. The antenna packaging module comprises an antenna substrate which is provided with a first side and a second side which are arranged oppositely, a first laminated circuit arranged on the first side of the antenna substrate, a radiation structure arranged on the second side of the antenna substrate, and a feed network comprising a 180-degree directional coupling structure arranged in the first laminated circuit and a transmission line penetrating through the antenna substrate and the first laminated circuit, whereinthe side, deviating from the antenna substrate, of the first laminated circuit is used for arranging a radio frequency chip. The antenna packaging module is advantaged in that by introducing a 180-degree directional coupling structure and respectively connecting the 180-degree directional coupling structure with the radio frequency chip and the radiation structure through the transmission line, the radiation structure can be fed to realize dual-polarized radiation, the isolation degree between feed ports is improved, and mutual coupling between antenna units is reduced.

Description

technical field [0001] The present application relates to the technical field of antennas, in particular to an antenna packaging module and electronic equipment. Background technique [0002] With the development of wireless communication technology, 5G network technology is also born. As the fifth-generation mobile communication network, 5G network has a peak theoretical transmission speed of tens of Gb per second, which is hundreds of times faster than that of 4G network. Therefore, the millimeter wave frequency band with sufficient spectrum resources has become one of the working frequency bands of the 5G communication system. [0003] The millimeter-wave packaged antenna module is the mainstream packaging solution in the future 5G millimeter-wave electronic equipment. It can adopt a multi-layer PCB high-density interconnection process and set a radiation structure on one side of the module. However, the application of millimeter-wave packaged antenna modules in high-is...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01Q1/22H01Q1/36H01Q1/38H01Q1/50H01Q1/52
CPCH01Q1/22H01Q1/36H01Q1/38H01Q1/50H01Q1/52
Inventor 贾玉虎
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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