Intelligent phone mainboard chip mounting device

Abstract

The invention relates to the technical field of chip mounting equipment, and further discloses an intelligent mobile phone mainboard chip mounting device. The device includes a chip mounting table , supporting legs are fixedly connected to four corners of the bottom of the chip mounting table; a U-shaped frame is fixedly mounted on the upper surface of the chip mounting table; an automatic chip mounter is fixedly mounted on the lower surface of the top of the U-shaped frame; a support plate is arranged below the automatic chip mounter; a clamping and positioning mechanism is mounted on the supporting plate; sliding rods are symmetrically and fixedly connected to the lower surface of the supporting plate. Annular grooves matched with the sliding rods are symmetrically formed in the upper surface of the chip mounting table. The bottom end of the sliding rod extends into the annular groove, the sliding rod is slidably connected with the annular groove, sliding grooves are symmetrically formed in the inner wall of the annular groove, sliding blocks matched with the sliding grooves are symmetrically and fixedly connected to the rod wall of the sliding rod, the sliding blocks are slidably connected with the sliding grooves, the sliding blocks abut against the side walls of the top ends of the sliding grooves, and springs are fixedly connected to the bottom end of the sliding rod. According to the intelligent mobile phone mainboard chip mounting device, the pressure borne by the mobile phone mainboard during patch can be conveniently regulated and controlled according to needs.

Description

technical field [0001] The invention relates to the technical field of chip mounting equipment, in particular to a chip chip mounting device for a smartphone motherboard. Background technique [0002] The main board is an important part of the smart phone equipment. During the production and processing of the main board, it is often necessary to attach some electrical components to the main board. However, it is inconvenient to exert pressure on the main board during the placement of the existing SMT device. Adjust it according to the needs. If the pressure is too high, it will damage the motherboard. If the pressure is too small, it will affect the stability of the patch. Therefore, it is necessary to invent a smart phone motherboard chip mounter to solve the above problems. Contents of the invention [0003] (1) Solved technical problems [0004] Aiming at the deficiencies of the prior art, the present invention provides a chip mounting device for the main board of a s...

AI Technical Summary

Problems solved by technology

[0004] Aiming at the deficiencies of the prior art, the present invention provides a chip mounting device for the main board of a smartphone, which has the advantage of conveniently adjusting the mounting pressure, and solves the problem that in the prior art, the mounting device exerts insufficient pressure on the motherboard during mounting. Easy to adjust the problem according to the need

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