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Harmonica-shaped tube radiator

A harmonica tube and radiator technology, applied in cooling/ventilation/heating transformation, modification of power electronics, electrical components, etc. The effect of increasing the heat dissipation area and improving the heat dissipation efficiency

Inactive Publication Date: 2020-03-27
ZHEJIANG JIAXI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the above-mentioned shortcomings of the prior art, the object of the present invention is to provide a harmonica tube radiator, which is used to solve the problems of low cooling efficiency and large volume of the radiator in the prior art

Method used

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  • Harmonica-shaped tube radiator
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  • Harmonica-shaped tube radiator

Examples

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Embodiment Construction

[0040] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

[0041] see Figure 1 to Figure 5 . It should be noted that the diagrams provided in this embodiment are only schematically illustrating the basic concept of the present invention, although only the components related to the present invention are shown in the diagrams rather than the number, shape and Dimensional drawing, the type, quantity and proportion of each component can be changed arbitrarily during actual implementation, and t...

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Abstract

The invention provides a harmonica-shaped tube radiator, which comprises a radiator substrate, at least one serpentine harmonica-shaped pipe, a first connecting pipeline, and a second connecting pipeline, wherein a heat transfer pipeline, a heat transfer pipeline inlet end and a heat transfer pipeline outlet end are formed in the radiator substrate; a heat dissipation pipeline is formed in the serpentine harmonica-shaped pipe, and the heat dissipation pipeline comprises an inlet end and an outlet end; one end of the first connecting pipeline is communicated with the outlet end of the heat transfer pipeline, and the other end is communicated with the inlet end of the radiating pipeline; one end of the second connecting pipeline is connected with the outlet end of the radiating pipeline, andthe other end is connected with the inlet end of the heat transfer pipeline; and the heat transfer pipeline, the heat dissipation pipeline, the first connecting pipeline and the second connecting pipeline form a circulation loop, and the circulation loop is filled with heat transfer working media. According to the harmonica-shaped tube radiator, the radiator base plate and the snakelike harmonica-shaped tube can be communicated under different installation and use occasions, so that limitation of the use environment of the radiator base plate is avoided, and the use field and the use range ofthe harmonica-shaped tube radiator are greatly expanded.

Description

technical field [0001] The invention relates to the technical field of heat dissipation, in particular to a harmonica tube radiator. Background technique [0002] In the prior art, power devices are widely used. The heat generated by power loss during operation of power devices will lead to an increase in the temperature of the power device chip, which may cause a decrease in performance and a shortened service life, or cause failure of the power device in severe cases. And chips blow up. [0003] In order to ensure the normal operation of power devices, the heat must be dissipated in a timely and effective manner. In the prior art, power devices are usually pasted on the surface of the heat sink to achieve heat dissipation; however, the heat dissipation efficiency of the existing heat sinks is low, and if the heat dissipation of high-power power devices is realized, the volume of the heat sink required is relatively large. Big. Contents of the invention [0004] In vie...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20145H05K7/20272H05K7/20327H05K7/209H05K7/20909H05K7/20927H05K7/20936
Inventor 卢忠亮韦小光
Owner ZHEJIANG JIAXI TECH CO LTD
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