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Heating device and temperature controlled spray assembly

A technology for spraying components and temperature control, which is applied to parts of connecting devices, spraying devices, coupling devices, etc., and can solve problems such as increasing costs

Active Publication Date: 2020-04-14
PIOTECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this regard, the known solution is to incorporate a filter that can suppress radio frequency signals in the electrical circuit of the electric heater, but this will undoubtedly increase the manufacturing cost and require additional installation and maintenance space

Method used

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  • Heating device and temperature controlled spray assembly
  • Heating device and temperature controlled spray assembly
  • Heating device and temperature controlled spray assembly

Examples

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Embodiment Construction

[0021] In the following detailed description of a number of exemplary embodiments, reference is made to the accompanying drawings, which form a part hereof. It is shown by way of illustration by way of example by which the described embodiments can be practiced. Sufficient detail is provided to enable those skilled in the art to practice the described embodiments, but it is understood that other embodiments may be utilized, and other changes may be made, without departing from the spirit or scope thereof. Furthermore, while this may be true, references to "an embodiment" do not necessarily pertain to that same or singular embodiment. Therefore, the following detailed description is not intended to be limiting, and the scope of the described embodiments is defined only by the appended claims.

[0022] In the entire specification and scope of the claims, unless the context clearly states otherwise, the following terms have the meanings clearly associated therewith. As used her...

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PUM

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Abstract

The invention discloses a heating device, which is applied to a plasma treatment semiconductor manufacturing device. The heating device comprises at least one heating wire extending in a coverage range of a radio frequency signal, a power supply used for providing a power signal to the at least one heating wire, and a temperature controller used for controlling the power supply at least based on adefault temperature. The at least one heating wire is covered by at least one shielding assembly and used for shielding the radio frequency signal so as to prevent the radio frequency signal from being electrically coupled to the at least one heating wire, the power supply and the temperature controller.

Description

technical field [0001] The present invention relates to a heating device, especially for a semiconductor manufacturing device for plasma processing, such as a heating device installed in a showerhead or a substrate support. Background technique [0002] In semiconductor manufacturing technology, it is known that increasing the temperature of the reacting substance or the environment can obtain a more ideal morphology of the deposited film, especially when the temperature is raised to 200° C., it is helpful for the reaction of the substance. There are known oil temperature heaters used in shower heads, but limited by the characteristics of oil, such heaters cannot be raised above 200°C, which cannot meet the requirements of the process. [0003] Electric heaters have been used to solve the lack of oil temperature heaters, but there are still concerns about the performance of electric heaters for specific treatments. In semiconductor manufacturing equipment dedicated to plasm...

Claims

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Application Information

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IPC IPC(8): B05B1/24B05B12/10H01R13/6581H01R13/6591
CPCB05B1/24B05B12/10H01R13/6591H01R13/6581
Inventor 戴佳卉王·苏格里高利吴凤丽
Owner PIOTECH CO LTD
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