Anisotropic composite profile and preparation method thereof

A composite profile and anisotropic technology, applied in the field of anisotropic composite profiles and their preparation, can solve the problems of poor material fit, complex production process and high production cost, and achieve improved production efficiency, simple production process steps and optimization. The effect of fit

Pending Publication Date: 2020-06-19
东莞市高酷纳米科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] (1) Carbon fibers, graphene, carbon nanotubes, metal nanowires or metal microflakes and other materials with high thermal conductivity are oriented in the thickness direction of silica gel. The production process is mainly the insertion method or the use of a magnetic field to achieve directional alignment. The production process is complex. Difficulty in mass production and high production cost
[0004] (2) Different sheets of heat-conducting materials are discharged at intervals, and different materials are closely connected, and the material adhesion is poor. The production process is mainly multi-layer lamination, which is cumbersome and inefficient.

Method used

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  • Anisotropic composite profile and preparation method thereof
  • Anisotropic composite profile and preparation method thereof
  • Anisotropic composite profile and preparation method thereof

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Embodiment Construction

[0029] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0030] see figure 1 , an anisotropic composite profile, comprising a heat-conducting silica gel 1 and a heat-conducting sheet 2, wherein the heat-conducting sheets 2 are arranged at intervals layer by layer, and the heat-conducting silica gel 1 is filled in the gap between two adjacent layers of heat-conducting sheets 2 to form a layer of heat-conducting silica gel.

[0031] Further, the thermally conductive silica gel 1 is composed of vinyl silicone oil, hydrogen-containing silicone oil, inhibitor, platinum vulcanizing agent and fi...

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Abstract

The invention discloses an anisotropic composite profile, which comprises heat conduction silica gel and heat conduction sheets. The heat conduction sheets are arranged layer by layer at intervals, and the heat conduction silica gel fills a gap between every two adjacent layers of heat conduction sheets to form a heat conduction silica gel layer. The structure is novel, the method is innovative, the attaching performance of the anisotropic heat conduction material is optimized, the application range of the anisotropic heat conduction material is expanded, the production process steps are simple, the production efficiency is improved, and the production cost is reduced.

Description

technical field [0001] The invention relates to the technical field of anisotropic heat-conducting materials, in particular to an anisotropic composite profile and a preparation method thereof. Background technique [0002] Thermally conductive silica gel is a commonly used heat conduction and heat dissipation module in electronics, electrical appliances, Netcom, lighting, automobiles, etc. At present, most anisotropic thermally conductive silicon wafers are prepared by the following two methods: [0003] (1) Carbon fibers, graphene, carbon nanotubes, metal nanowires or metal microflakes and other materials with high thermal conductivity are oriented in the thickness direction of silica gel. The production process is mainly the insertion method or the use of a magnetic field to achieve directional alignment. The production process is complex. Mass production is difficult and the production cost is high. [0004] (2) Different thin sheets of heat-conducting materials are dis...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B9/00B32B9/04B32B15/06B32B15/20B32B25/20B32B37/10
CPCB32B9/007B32B9/043B32B15/06B32B15/20B32B25/20B32B37/1018B32B2038/0076B32B2250/40B32B2307/302
Inventor 余惠珍杨晔
Owner 东莞市高酷纳米科技有限公司
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