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Air conditioner heat dissipation method, heat dissipation device and air conditioner

A heat dissipation method and heat dissipation device technology, applied in the field of heat dissipation devices, air conditioners, and air conditioner heat dissipation methods, can solve the problems of IPM temperature imbalance, reduced service life of heating devices 13, and large thermal stress, so as to solve the problem of service life and Other potential safety hazards, improving the safety performance of use, and reducing the effect of thermal stress

Active Publication Date: 2020-09-22
QINGDAO TECHNOLOGICAL UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in actual use, the temperature of IGBT1 located at the upper end (near the wind end B) of the IPM is higher than that of IGBT3 located at the lower end (near the wind end A), which causes the temperature imbalance of the IPM. high thermal stress
This thermal stress accumulation will cause the reduction of the service life of the heating device 13 if it is light, and will cause the fracture damage of the device when it is serious, and there will be a safety hazard.

Method used

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  • Air conditioner heat dissipation method, heat dissipation device and air conditioner
  • Air conditioner heat dissipation method, heat dissipation device and air conditioner
  • Air conditioner heat dissipation method, heat dissipation device and air conditioner

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[0028] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.

[0029] It should be noted that, in the description of the present invention, the terms "upper", "lower", "front", "rear", etc. indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings, This is for convenience of description only, and does not indicate or imply that the device or element must have a specific orientation, be constructed and operate in a specific orientation, and thus should not be construed as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and should not be understood as indicating or implying relative importance.

[0030] Figure 4 to Figure 7 An embodiment of the air conditioner b...

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Abstract

The invention discloses an air conditioner heat dissipation method, a heat dissipation device and an air conditioner. The method comprises the steps: acquiring the sampling temperature of a radiator;comparing the sampling temperature with a set temperature threshold value; when the sampling temperature is not larger than the set temperature threshold value, controlling the wind direction of the wind field where the radiator is located to keep running in the first wind direction; when the sampling temperature is greater than the set temperature threshold value, controlling the wind direction of the wind field where the radiator is located to be changed into a second wind direction for operation, wherein the second wind direction is opposite to the first wind direction. By applying the heating device, thermal stress generated by uneven temperature of the air conditioner radiator can be reduced, and the use safety performance of the heating device is improved.

Description

technical field [0001] The invention belongs to the technical field of air conditioning, in particular to an air conditioner, and more specifically to a heat dissipation method for an air conditioner, a heat dissipation device and an air conditioner. Background technique [0002] The frequency converter of the air conditioner is usually equipped with heating devices such as silicon bridges and IPM modules. During the use of the air conditioner, these devices will generate more and more heat as the current of the air conditioner increases. The heat generated by the heat-generating device will reduce the service life of the device. In order to ensure the service life of the device, the heat sink is usually used to dissipate heat for the inverter, thereby reducing the temperature of the heat-generating device on the inverter. [0003] A fan is arranged in the air conditioner, and a wind field is formed by the rotation of the fan, and the heat dissipation of the radiator can be ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20F24F11/64F24F11/79F24F13/00
CPCH05K7/20209H05K7/20145H05K7/20172F24F11/64F24F11/79F24F13/00
Inventor 秦臻张伟郝宇婷
Owner QINGDAO TECHNOLOGICAL UNIVERSITY
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