Large-current combined high-temperature inductor and processing method thereof

Abstract

The invention discloses a large-current combined high-temperature inductor and a processing method thereof. The whole inductor is formed by bonding and combining an inductance magnet and an inductanceconductor. The inductance magnet comprises an external inductance magnet and at least one internal inductance magnet; the external inductance magnet is integrally formed, at least one conductor containing groove used for containing the inductance conductors is formed in the external inductance magnet in a penetrating mode, one inductance conductor is arranged in each conductor containing groove,and the remaining space in each inductance conductor and the remaining space in the corresponding conductor containing groove are filled with one internal inductance magnet. Effective integration of the inductor is achieved, the overall shape of the inductor is regular, pins on the inductor are all arranged on the outer surface of the same side of an inductor finished product, the shielding performance of the inductor is guaranteed, the overall size and occupied space of the inductor are reduced, and convenience is provided for subsequent installation and use of the inductor.

Description

technical field [0001] The invention relates to a high-temperature inductor and a corresponding processing method thereof, in particular to a high-current combined high-temperature inductor and a processing method thereof, belonging to the technical field of inductor processing. Background technique [0002] Inductor is the most common component in electronic equipment, and it is also one of the important components in the circuit. It is widely used in various circuits and can achieve the functions of filtering, energy storage, matching and resonance. [0003] With the continuous development of the Internet, the Internet of Things and other fields, the overall level of science and technology has improved. As the hardware foundation of various technologies, various types of intelligent electrical equipment have been updated more and more frequently. Taking the popular cloud computing technology in recent years as an example, when implementing cloud computing services, it is n...

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Problems solved by technology

In the subsequent actual use process, it is easy to have problems such as the deterioration of the adhesive effect and the separation of parts due to the aging of the adhesive.

At the same time, when the inductive device is fed with a large current and is in a high-frequency environment, the internal components of the device are prone to jitter, which will generate serious noise

[0007] Thirdly, in order to realize the adjustment of the magnetic circuit and resistance value, air gaps are often provided in the inductance devices in the prior art. After the magnet is formed, moderately precise grinding is carried out, which not only increases the difficulty of the overall production of the device, but also increases the production cost, which is not convenient for automatic production

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