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Automatic material module testing and packaging system and method

A module testing and packaging system technology, applied in the field of automation, can solve the problems of low efficiency of manual operation, error-prone sorting for a long time, and employee operation errors, and achieves the effect of saving reclaiming time, simple structure and increasing production capacity.

Active Publication Date: 2020-11-27
ZHEJIANG DESIGN ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The traditional test and packaging system is divided into two modes: full manual or artificial plus intelligence. A considerable part is manually sorting, testing and packaging the circuit modules one by one. However, manual work has low efficiency and high fatigue intensity. It is easy to make mistakes when picking, and there are also problems such as the risk of employee operation errors; so there is an urgent need for an automated testing and packaging system that can be fully automated and unmanned; to achieve batch testing and packaging of circuit modules; to automate the testing and packaging system High degree, can reduce the production cost of the enterprise

Method used

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  • Automatic material module testing and packaging system and method
  • Automatic material module testing and packaging system and method
  • Automatic material module testing and packaging system and method

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specific Embodiment approach

[0063] Such as Figure 1-24 As shown, the present invention provides a kind of automatic material module testing packaging system, the main purpose of this testing packaging system is to carry out automatic batch testing and packaging on the assembly line to the circuit module of electronic equipment; A material recovery device A, a feeding device B, a testing device C and a packaging device D arranged along the X-axis direction; a conveying mechanism 25 is connected between the feeding device B and the testing device C, and between the testing device C and the testing device C An output mechanism 40 is connected between the packaging devices D.

[0064] Specifically: if Figure 1-6 As shown, the pallet loading and recycling device A includes a frame 1, and a lower conveying assembly 2 is provided below the frame 1. The front end of the lower conveying assembly 2 has a pallet placement station 3, and a plurality of pallets 4. After stacking, place it on the pallet placement ...

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Abstract

The invention discloses an automatic material module testing and packaging system and method. The system comprises a tray feeding and recycling device, a feeding device, a conveying mechanism, an output mechanism, a testing device and a packaging device; the tray feeding and recycling device conveys trays loaded with material modules to a material taking station; the feeding device acts on the tray at the material taking station to convey the material modules on the trays to the conveying mechanism, and the material modules are conveyed to the testing device by the conveying mechanism; the testing device is provided with a sorting mechanical arm and a testing assembly, the sorting mechanical arm conveys the material modules on the conveying mechanism to the testing assembly for testing, and after testing is completed, the sorting mechanical arm takes out the material modules again and places the material modules on the output mechanism; the output mechanism conveys the material modulesto the packaging device; the packaging device is provided with a third suction assembly and a braid packaging assembly; and the third suction assembly sucks the material modules on the output mechanism and sends the material modules to the braid packaging assembly for braid packaging. The system can realize unmanned management and improve the productivity.

Description

technical field [0001] The invention relates to the field of automation, in particular to an automated material module testing and packaging system and method. Background technique [0002] In the prior art, in the development and manufacturing stages of various electronic products, the circuit modules of the electronic devices need to be tested independently, and then the tested circuit modules are taped and packaged. Under the demand of mass supply, the number of circuit modules that need to be tested and packaged is very large, and they are often mass-produced and packaged through automated assembly lines. [0003] The above-mentioned automated assembly line is often composed of a feeding part, a testing part, a packaging part and a transmission part to form a test packaging system. Products in production or processed products are transported to the test packaging system for packaging and processing. After completion, it is sent out as a complete packaged product for eas...

Claims

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Application Information

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IPC IPC(8): B65B15/04B65B65/00B65B35/38B65G47/91B65G61/00B07C5/02B07C5/36
CPCB65B15/04B65B65/003B65B35/38B65G47/912B65G61/00B07C5/02B07C5/362B07C2501/0063
Inventor 张晓英
Owner ZHEJIANG DESIGN ELECTRONICS TECH
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