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Housing assembly, antenna assembly and electronic device

A technology for housing components and electronic equipment, applied in antenna parts, antennas, electrical equipment shells/cabinets/drawers, etc., can solve problems such as poor communication performance of millimeter wave signals, and achieve the effect of improving communication performance

Active Publication Date: 2022-03-01
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present application provides a shell assembly, antenna module and electronic equipment to solve the technical problem of poor communication performance of traditional millimeter wave signals

Method used

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  • Housing assembly, antenna assembly and electronic device
  • Housing assembly, antenna assembly and electronic device
  • Housing assembly, antenna assembly and electronic device

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Embodiment Construction

[0070] The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only some of the embodiments of the application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0071] Please also refer to figure 1 , figure 1 It is a schematic structural diagram of the housing assembly provided in the first embodiment of the present application. The housing assembly 100 includes a dielectric substrate 110 and a wave-transmitting structure 120 . The dielectric substrate 110 has a first equivalent wave impedance for radio frequency signals in a preset frequency band, and the difference between the first equivalent wave impedance and the equivalent wave impe...

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Abstract

The application provides a housing assembly, an antenna assembly and electronic equipment. The shell assembly includes a dielectric substrate and a wave-transparent structure. The dielectric substrate has a first equivalent wave impedance for radio frequency signals in a preset frequency band, and a difference between the first equivalent wave impedance and the equivalent wave impedance of free space is a first difference. The wave-transparent structure is carried on the dielectric substrate and at least partially covers a partial area of ​​the dielectric substrate. The shell assembly has a second equivalent wave impedance for the radio frequency signal of the preset frequency band in the area corresponding to the wave transparent structure, and the difference between the second equivalent wave impedance and the wave impedance of free space The difference is a second difference, wherein the second difference is smaller than the first difference. When the housing assembly is applied to electronic equipment, the impact of the housing assembly on the radiation performance of the antenna module disposed inside the electronic equipment can be reduced, thereby improving the communication performance of the electronic equipment.

Description

technical field [0001] The present application relates to the field of electronic equipment, in particular to a housing assembly, an antenna assembly and electronic equipment. Background technique [0002] With the development of mobile communication technology, traditional fourth-generation (4th-Generation, 4G) mobile communication cannot meet people's requirements. The fifth generation (5th-Generation, 5G) mobile communication is favored by users due to its high communication speed. For example, when using 5G mobile communication to transmit data, the transmission speed is hundreds of times faster than that of 4G mobile communication. Millimeter wave signals are the main means to realize 5G mobile communication. However, when millimeter wave antennas are applied to electronic equipment, millimeter wave antennas are usually set in the storage space inside the electronic equipment, and the millimeter wave signal antenna radiates out through the electronic equipment. The tr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01Q15/08H01Q19/06H05K5/00H04B1/3827
CPCH01Q15/08H01Q19/06H05K5/0086H04B1/3827H04M1/0266H04M1/026H01Q1/421H01Q1/243H01Q15/0006H01Q15/0013H01Q5/335H01Q1/38H01Q21/0025
Inventor 贾玉虎
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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