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Power Adapter

A technology for power adapters and circuit boards, applied in electrical components, structural parts of electrical equipment, cooling/ventilation/heating transformation, etc., to eliminate hot spots, improve user experience, and improve heat dissipation performance

Active Publication Date: 2022-04-08
HUAWEI DIGITAL POWER TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the power adapter is working, the internal electronic components will generate a lot of heat. At the same time, in order to meet the needs of customers for portability and improve competitiveness, the size of the adapter continues to evolve towards miniaturization, and the heat consumption density continues to rise. Hot spots, the heat dissipation challenge faced by power adapters in the future will be even greater

Method used

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Embodiment Construction

[0043] The embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.

[0044] see figure 1 , figure 2 and image 3 , the embodiment of the present application provides a power adapter 100 , including a housing 10 , a circuit board assembly 20 and a temperature uniform heat conducting member 30 . A housing space 101 is formed inside the housing 10 , and the circuit board assembly 20 and the temperature uniform heat conducting element 30 are located in the housing space 101 in the housing 10 . The uniform temperature heat conduction element 30 includes a sealed cavity 31 and a working fluid filled inside the sealed cavity 31. The sealed cavity 31 is made of a heat-conducting metal material. The sealed cavity 31 includes a cavity wall and a sealed cavity surrounded by the cavity wall. The fluid is located in the sealed chamber, and the inner wall of the sealed chamber 31 is provided with a capi...

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Abstract

An embodiment of the present application provides a power adapter, including a housing, a circuit board assembly, and a temperature-equalizing heat-conducting element. The working fluid inside the sealed cavity is made of heat-conducting metal, and the inner wall of the sealed cavity is provided with a capillary structure layer; the circuit board assembly includes a circuit board and heating electronic components arranged on the circuit board; The circuit board assembly is connected by heat conduction, and the position of the sealed cavity of the uniform temperature heat conduction element corresponds to the heating electronic component on the circuit board. During the charging process of the power adapter, the uniform temperature heat conduction member can timely and effectively disperse and export the heat of the hot spot inside the adapter evenly, eliminate the hot spot inside the adapter, obtain a uniform temperature effect, improve the heat dissipation performance of the adapter, and help to improve the charging power design of the adapter value and adapt to miniaturization while enhancing user experience.

Description

technical field [0001] The embodiments of the present application relate to the technical field of power adapters, in particular to a power adapter with good heat dissipation performance. Background technique [0002] The power adapter is a power supply conversion device for small portable electronic devices and electronic appliances, and is widely used in consumer electronic products such as smartphones, tablet computers, and notebook computers. With the rapid development of smart phones and notebook computers, the charging power and charging current of power adapters are gradually increasing. When the power adapter is working, the internal electronic components will generate a lot of heat. At the same time, in order to meet the needs of customers for portability and improve competitiveness, the size of the adapter continues to evolve towards miniaturization, and the heat consumption density continues to rise. Hot spots, the heat dissipation challenge faced by power adapte...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20H02M7/00
CPCH05K7/2029H05K7/2039H05K7/205H02M7/003
Inventor 徐春霞惠晓卫武昊陈君
Owner HUAWEI DIGITAL POWER TECH CO LTD
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