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A kind of packaging equipment and packaging method of air-sensitive two-dimensional material device

A two-dimensional material and packaging equipment technology, applied in electrical components, devices for coating liquid on surfaces, coatings, etc., can solve problems such as orbital hybridization, and achieve the effect of ensuring reliability and protecting the gas environment.

Active Publication Date: 2022-03-18
NANJING UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the existing problem that orbital hybridization is easily generated when two layers of graphene or boron nitride are stacked on the upper and lower layers of the two-dimensional material to be tested, the present invention provides an air-sensitive two-dimensional material device packaging equipment and packaging method

Method used

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  • A kind of packaging equipment and packaging method of air-sensitive two-dimensional material device
  • A kind of packaging equipment and packaging method of air-sensitive two-dimensional material device

Examples

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Effect test

Embodiment 1

[0042] Equipment structure and connection method:

[0043] This embodiment provides a packaging device for an air-sensitive two-dimensional material device, including a glue supply device, a fixing device, and an operating device placed inside an integrated cavity; a Raman spectrometer is built in the packaging device, and the operating device is used to control the feeding device. The glue device moves and is placed in the integrated chamber after assembly.

[0044] The fixing device includes a base 3 fixed inside the packaging device for placing the sample base 1 and the cover glass 2 . The operating device is a CNC linear guide rail linear sliding table module composed of a precision stepping cross motor and a ball screw guide rail, which can precisely control the movement of the sliding table by writing G codes. The dispensing device includes a dispensing needle 6, an air pump 7 and an air flow controller 13 are connected to the dispensing needle 6, the air pump 7 extrude...

Embodiment 2

[0059] The packaging method of the air-sensitive two-dimensional material device in this embodiment is carried out by using the air-sensitive two-dimensional material device packaging equipment in Example 1.

[0060] Wherein, the base 3 is fixed on the right edge of the packaging system platform 9, which is convenient for the two steps of glue dispensing and capping.

[0061] The bracket 4 has two circular grooves for fixing the dispensing needle tube 6 and the suction cup needle tube 5, and is fixed on the numerical control mechanical arm of the packaging system by screws. The dispensing needle tube 6 is placed on the suction cup needle tube 5 right sides, five centimeters apart. When the dispensing needle tube 6 is dispensing glue (encapsulation glue) on the sample base 1, the suction cup needle tube 6 is suspended outside the base 3; when the suction cup needle tube 6 picks up the cover glass 2 and hovers over the two-dimensional material, the The needle tube 6 is suspende...

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Abstract

The invention discloses an air-sensitive two-dimensional material device packaging equipment and a packaging method, belonging to the field of two-dimensional material packaging and testing. The packaging method using this equipment is to package the two-dimensional material device in a closed space formed by the base, the cover glass and the packaging glue higher than the thickness of the two-dimensional material device in an inert gas environment. In this way, the air is encapsulated. Sensitive two-dimensional material devices avoid the traditional orbital hybridization problem that is easy to occur when a layer of graphene or boron nitride is stacked on the top and bottom of the two-dimensional material to be tested, and protect the material from or less affected by the external environment , using the equipment to perform two Raman tests at the same time, excluding the influence of the cover glass, providing a safe and stable environment for the follow-up research and testing of air-sensitive two-dimensional material devices.

Description

technical field [0001] The invention belongs to the field of packaging and testing of two-dimensional materials, and more specifically relates to packaging equipment and packaging methods for air-sensitive two-dimensional material devices, which can realize efficient packaging, testing and protection of two-dimensional material semiconductor devices. Background technique [0002] Since the discovery of graphene in 2004, the search for other new two-dimensional crystal materials has been at the forefront of the field of two-dimensional material research. Just like graphene, other two-dimensional crystals with large size and high quality are not only very important for exploring new physical phenomena and properties under the two-dimensional limit, but also have many novel applications in the fields of electronics and optoelectronics. In recent years, in addition to graphene, two-dimensional materials such as two-dimensional hexagonal boron nitride, transition metal sulfides, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05D3/04B05C5/02B05D1/26H05K9/00
CPCB05D1/26B05D3/0486B05C5/0212H05K9/0007H05K9/0081
Inventor 于葛亮蒋斯奇黄佳贝肖经宽陈忻韩亚清张棣王萍蔡晓凡马国栋成澳雪廉富镯卢文刚亚历山大·马耶罗夫杜人君王乙博
Owner NANJING UNIV
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