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Packaging equipment for air-sensitive two-dimensional material device and packaging method

A technology of two-dimensional materials and packaging methods, applied in electrical components, devices for coating liquid on surfaces, surface pretreatment, etc., can solve problems such as orbital hybridization, and achieve the effect of ensuring reliability

Active Publication Date: 2021-03-19
NANJING UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the existing problem that orbital hybridization is easily generated when two layers of graphene or boron nitride are stacked on the upper and lower layers of the two-dimensional material to be tested, the present invention provides an air-sensitive two-dimensional material device packaging equipment and packaging method

Method used

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  • Packaging equipment for air-sensitive two-dimensional material device and packaging method
  • Packaging equipment for air-sensitive two-dimensional material device and packaging method

Examples

Experimental program
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Effect test

Embodiment 1

[0042] Equipment structure and connection mode:

[0043] In this embodiment, an air-sensitive two-dimensional material device is provided, including a gum apparatus, a fixing device, and an operation device disposed inside an integrated cavity; a laptometer is placed in a package device, and the operating device is used to control it. The rubber device moves, and the assembly is completed in the integrated cavity.

[0044] The fixture includes a substrate 3 fixed inside the package device for placement of the sample base 1 and the block slide 2. The operating device is a CNC linear rail linear slide module composed of a precision step crosshair cross-cross motor and a ball screw guide, and the G code can accurately control the movement of the slide. The gum apparatus includes a dot rubber pin tube 6, the air pump 7 and the airflow flow controller 13 are connected to the dispensing needle tube 6, and the gas pump 7 extruders the packaged grease by applying a pressure, and the dispe...

Embodiment 2

[0059] The packaging method of the air sensitive two-dimensional material device is carried out by the air sensitive two-dimensional material device package apparatus in Example 1.

[0060] Wherein, the substrate 3 is fixed to the right side of the package system platform 9, which is easy to contact the fitting of the dispensing and the cover of the block.

[0061] The bracket 4 has a fixed point glue tube 6 and two round grooves of the suction cup needle 5, and is fixed to the encapsulation system CNC robot by screws. Dispensing pipe 6 is placed on the top right side of the suction cup and 5 cm. When the point rubber pin tube 6 dispensed (encapsulated glue) on the sample base 1, the suction cup needle tube 6 is suspended outside the substrate 3; when the suction cup pin tube 6 sucks up the block slide 2 and hovering over the two-dimensional material, point glue The needle tube 6 is suspended from the outside of the package system platform, and the two do not interfere.

[0062] T...

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Abstract

The invention discloses packaging equipment for an air-sensitive two-dimensional material device and a packaging method, and belongs to the field of two-dimensional material packaging measurement. Thepackaging method utilizing the equipment comprises the following step of packaging the two-dimensional material device in a closed space formed by a base, a covering slide and a packaging adhesive ofwhich the thickness is higher than that of the two-dimensional material device in an inert gas environment; the method is used for packaging the air-sensitive two-dimensional material device, so thatthe problem that orbital hybridization is likely to be generated when a layer of graphene or boron nitride is stacked on each of the upper portion and the lower portion of a to-be-tested two-dimensional material for packaging traditionally is solved, and the material is protected against or less affected by the external environment; and Raman testing is conducted twice through the equipment, theinfluence of the covering slide is eliminated, and a safe and stable environment is provided for subsequent research and testing of the air-sensitive two-dimensional material device.

Description

Technical field [0001] The present invention belongs to the field of two-dimensional material, and more particularly to an encapsulation apparatus and packaging method of an air-sensitive two-dimensional material device, which can achieve efficient package, test and protection of two-dimensional material semiconductor devices. Background technique [0002] Since the 2004 Pretine Ohthylene, other new two-dimensional crystal materials have been explored from the frontiers of the two-dimensional material research. As graphene, large-scale high-quality other two-dimensional crystals are not only important to explore new physical phenomena and performance under the two-dimensional limit, but also have many novel applications in the fields of electronics and optoelectronics. In recent years, two-dimensional materials such as graphene, two-dimensional hexagonal boron, transduceral metal sulfide, oxide, black phosphorus are also prepared, greatly expanding the performance and application...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05D3/04B05C5/02B05D1/26H05K9/00
CPCB05D1/26B05D3/0486B05C5/0212H05K9/0007H05K9/0081
Inventor 于葛亮蒋斯奇黄佳贝肖经宽陈忻韩亚清张棣王萍蔡晓凡马国栋成澳雪廉富镯卢文刚亚历山大·马耶罗夫杜人君王乙博
Owner NANJING UNIV
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