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Package structure and manufacturing method thereof

A packaging structure and molding technology, which is applied in the direction of printed circuits and printed circuit components connected with non-printed electrical components, can solve the problems of increasing the cost of molds and increasing the overall cost of modules.

Active Publication Date: 2022-04-08
WISTRON NEWEB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, under the requirements of such selective molding, it often leads to an increase in the cost of the mold, which in turn increases the overall cost of the module.

Method used

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  • Package structure and manufacturing method thereof
  • Package structure and manufacturing method thereof
  • Package structure and manufacturing method thereof

Examples

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no. 1 example

[0077] First, see Figure 1 to Figure 3 as shown, figure 1 and figure 2 are three-dimensional schematic diagrams of the packaging structure of the first embodiment of the present invention, image 3 It is a three-dimensional exploded schematic view of the packaging structure of the first embodiment of the present invention. The present invention provides a packaging structure U and a manufacturing method thereof. In the first embodiment, the overall structure of the packaging structure U will be introduced first, and the manufacturing method of the packaging structure U will be described in subsequent embodiments. In addition, it is worth noting that, in one embodiment, the packaging structure U provided by the present invention and its manufacturing method can be used to package semiconductor elements, chips or circuits, and the present invention is not limited thereto.

[0078] Next, see Figure 1 to Figure 3 As shown, the packaging structure U may include: a circuit bo...

no. 2 example

[0087] First, see Image 6 shown, and please refer to the Figure 9 to Figure 16 as shown, Image 6 It is a flow chart of the manufacturing method of the packaging structure according to the second embodiment of the present invention, Figure 9 to Figure 16 They are schematic diagrams of the manufacturing process of the package structure according to the second embodiment of the present invention. It should be noted that the features of each element in the manufacturing method of the package structure U provided by the second embodiment are similar to those of the foregoing embodiments, and will not be repeated here.

[0088] Next, see Image 6 and Figure 9 As shown, as shown in step S102, a circuit board module 1A is provided, and the circuit board module 1A may include a substrate assembly 11A, a first array element group 12A and a second array element group 12B, the first array element group 12A and the The second array element group 12B is disposed on a molding area ...

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Abstract

The invention discloses a packaging structure and a manufacturing method thereof. The packaging structure includes: a circuit board, a barrier structure and a molding layer; the circuit board includes a substrate and a component arranged on the substrate, the substrate includes a molding area and a non-molding area, and the components are arranged on the molding On the region; the barrier structure is disposed on the substrate and between the molded area and the non-molded area, the barrier structure has a first predetermined height; the molded layer is disposed on the molded area and covers the component, and the molded layer has a first Two predetermined heights, the first predetermined height is less than or equal to the second predetermined height. The packaging structure and manufacturing method provided by the invention can achieve the technical effect of selective packaging.

Description

technical field [0001] The present invention relates to a packaging structure, in particular to a packaging structure and a manufacturing method thereof. Background technique [0002] In the semiconductor element or system packaging in the prior art, in order to protect the reliability of the solder ball joints, expensive precision molds must be used for the molding process. In the case of some special designs, there will be a requirement to form a part of the area that needs to be protected by molding and an area that cannot be molded on the same module. Therefore, under the requirement of such selective molding, the cost of the mold is often increased, thereby increasing the overall cost of the module. [0003] Therefore, how to reduce the cost of the packaging process and packaging structure by improving the structure design and process design to overcome the above-mentioned defects has become one of the important issues to be solved by this business. [0004] Therefore...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K1/18
CPCH05K1/02H05K1/18
Inventor 沈里正洪英博詹朝杰汪朝轩
Owner WISTRON NEWEB