Case structure facilitating cleaning interior of computer

A computer and convenient technology, applied in the field of computers, can solve the problems of narrow gaps of heat dissipation fins, inconvenient cleaning, frequent cleaning of heat dissipation fins, etc., and achieve the effect of increasing air jet speed, convenient cleaning, and reducing cleaning frequency

Active Publication Date: 2021-06-15
ANHUI BUSINESS COLLEGE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a chassis structure that is convenient for cleaning the inside of the computer, so as to solve the technical problems in the pr

Method used

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  • Case structure facilitating cleaning interior of computer
  • Case structure facilitating cleaning interior of computer
  • Case structure facilitating cleaning interior of computer

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Embodiment Construction

[0026] The specific embodiments of the present invention will be further described in detail by describing the embodiments below with reference to the accompanying drawings, so as to help those skilled in the art have a more complete, accurate and in-depth understanding of the inventive concepts and technical solutions of the present invention.

[0027] like Figure 1-8As shown, the present invention provides a chassis structure that is convenient for cleaning the interior of the computer, including a chassis shell 1, a side sealing plate 2 and an independent radiator 5, and the independent radiator 5 includes cooling fins 501 installed on the heating element 7 and an independent fan, characterized in that: an air compressor 3 is provided on the chassis shell 1, and a ventilation structure 4 and a ventilation pipe 402 rotatably connected to the ventilation structure 4 are arranged on the inner side of the chassis casing 1, so that The side of the ventilation pipe 402 is fixed ...

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Abstract

The invention discloses a case structure facilitating cleaning the interior of a computer. The case structure comprises a case shell, a side sealing plate and an independent radiator; the independent radiator comprises radiating fins and an independent fan; an air compressor is arranged on the case shell; the air compressor is connected with a fin cleaning device through an air path for supplying air; the fin cleaning device comprises an annular shell, an annular track installed below the annular shell, an air injection assembly moving along the annular track, an air inlet channel and a pulse gas generation structure arranged on the air injection assembly; the pulse gas generation structure is communicated with the air path through the air inlet channel; the pulse gas generation structure is communicated with the air injection assembly to output pulse gas; and the annular track surrounds the heat dissipation fins. According to the case structure, air injection cleaning can be carried out on gaps among the radiating fins from the side surface, and even dust in the gaps can be cleaned, so that the cleaning effect is good.

Description

technical field [0001] The invention belongs to the field of computers and relates to a case structure for cleaning the inside of a computer conveniently. Background technique [0002] At present, in the computer case of the commonly used personal computer, a corresponding cooling system needs to be installed for the purpose of heat dissipation. Since the CPU, graphics card and other components are very hot during operation, it is often further set up on the basis of the heat dissipation structure of the conventional case for the CPU and graphics card. Independent heat sinks for components such as to enhance the heat dissipation effect of these components. In order to enhance heat dissipation, independent heat sinks are often installed on components that generate large amounts of heat, such as the CPU and North Bridge. Usually, the heat sink includes a heat sink assembly composed of multiple heat dissipation fins, and is installed above the heat sink assembly to enhance heat...

Claims

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Application Information

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IPC IPC(8): B08B5/02B08B13/00G06F1/18G06F1/20
CPCB08B5/02B08B13/00G06F1/183G06F1/20
Inventor 李春秋何军唐沛田云开
Owner ANHUI BUSINESS COLLEGE
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