Liquid baffle structure, etching equipment prepared from liquid baffle structure and etching method
A technology of etching equipment and liquid baffle, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc. It can solve the problems of vacuum suction plate and eddy current formation, increase air permeability, and reduce the risk of substrate scratches or fragments Effect
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[0078] First, see figure 2 and image 3 As shown, it is a schematic diagram of the overall structure of a preferred embodiment of the liquid baffle structure of the present invention, and a schematic diagram of the arrangement of drain holes, wherein the liquid baffle structure 10 of the present invention is suitable for a wet etching machine (not shown in the drawings), the The liquid baffle structure 10 includes a first baffle 11, a second baffle 12 joined to the first baffle 11, and a third baffle 13 joined to the second baffle 12, and its main features are : the second baffle plate 12 has a plurality of drain holes 121 penetrating through the second baffle plate 12 and arranged in dislocation.
[0079] The first baffle 11 and the second baffle 12 are arranged orthogonally, and the second baffle 12 and the third baffle 13 are arranged orthogonally, so that the first baffle 11, the second baffle The plate 12 and the third baffle 13 are surrounded by a groove. In one embod...
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