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Liquid baffle structure, etching equipment prepared from liquid baffle structure and etching method

A technology of etching equipment and liquid baffle, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc. It can solve the problems of vacuum suction plate and eddy current formation, increase air permeability, and reduce the risk of substrate scratches or fragments Effect

Pending Publication Date: 2021-06-18
MANZ TAIWAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] see figure 1 As shown, it is a schematic diagram of the overall arrangement of the traditional liquid baffle structure, wherein a liquid baffle structure A in the form of a solid PVC plate is set in a wet etching machine (not shown in the drawing), and is mainly used to block an etching liquid ( (not shown in the drawing) spraying the substrate (not shown in the drawing) arranged under the liquid baffle structure A causes uneven etching, and in the process steps of wet etching, the substrate is arranged on two air knives Between B, when the substrate is set on a conveying device (not shown in the drawing) and receives the etching solution from the left side of the liquid baffle structure A, it moves between the air knives B, and the air knives B spray again A gas C is blown to the surface of the substrate to blow off the residual etching solution on the surface of the substrate; however, when the air knives B are blowing air, it is easy to form tiny The vortex is formed in the vacuum space and causes the problem of the vacuum suction plate; therefore, how to effectively use the innovative hardware design to achieve the liquid blocking effect of the original liquid baffle, and increase the air permeability to break the vacuum to reduce the vacuum caused by the vacuum suction plate The risk of substrate scratches or fragments is still a problem that developers and researchers in related industries such as wet etching machines need to continue to work hard to overcome and solve

Method used

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  • Liquid baffle structure, etching equipment prepared from liquid baffle structure and etching method
  • Liquid baffle structure, etching equipment prepared from liquid baffle structure and etching method
  • Liquid baffle structure, etching equipment prepared from liquid baffle structure and etching method

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Embodiment Construction

[0078] First, see figure 2 and image 3 As shown, it is a schematic diagram of the overall structure of a preferred embodiment of the liquid baffle structure of the present invention, and a schematic diagram of the arrangement of drain holes, wherein the liquid baffle structure 10 of the present invention is suitable for a wet etching machine (not shown in the drawings), the The liquid baffle structure 10 includes a first baffle 11, a second baffle 12 joined to the first baffle 11, and a third baffle 13 joined to the second baffle 12, and its main features are : the second baffle plate 12 has a plurality of drain holes 121 penetrating through the second baffle plate 12 and arranged in dislocation.

[0079] The first baffle 11 and the second baffle 12 are arranged orthogonally, and the second baffle 12 and the third baffle 13 are arranged orthogonally, so that the first baffle 11, the second baffle The plate 12 and the third baffle 13 are surrounded by a groove. In one embod...

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Abstract

The invention relates to a liquid baffle structure, etching equipment prepared from the liquid baffle structure and an etching method, in particular to the liquid baffle structure which is suitable for liquid blocking and discharging functions of a wet etching machine and improves the air permeability of the wet etching machine so as to reduce product loss, the etching equipment prepared from the liquid baffle structure and the etching method. By means of the design that the liquid baffle structure with the plurality of venting holes is matched with an air knife device, air blown out by the air knife device can be effectively vented through the venting holes, and the surface tension phenomenon of water drops is utilized to prevent the water drops from falling from the venting holes to cause abnormal phenomena such as non-uniform development of the substrate, so that main advantages that the liquid blocking effect of an original liquid blocking plate is ensured, and the air permeability is increased to break vacuum so as to reduce the risk that the substrate is scratched or broken due to the vacuum suction plate are achieved.

Description

technical field [0001] The invention relates to a liquid baffle structure and the etching equipment and etching method prepared therefrom, in particular to a liquid baffle that is suitable for the liquid blocking and draining function of a wet etching machine and increases its air permeability to reduce product loss Structure and etching equipment prepared therefrom, and etching method. Background technique [0002] see figure 1 As shown, it is a schematic diagram of the overall arrangement of the traditional liquid baffle structure, wherein a liquid baffle structure A in the form of a solid PVC plate is set in a wet etching machine (not shown in the drawing), and is mainly used to block an etching liquid ( (not shown in the drawing) spraying the substrate (not shown in the drawing) arranged under the liquid baffle structure A causes uneven etching, and in the process steps of wet etching, the substrate is arranged on two air knives Between B, when the substrate is set on ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67075
Inventor 邱显炜郑宇轩李宗荣
Owner MANZ TAIWAN