Waste heat recovery type immersed phase change cooling system
A technology of phase change cooling and waste heat recovery, applied in indirect heat exchangers, lighting and heating equipment, instruments, etc., can solve the problems of waste of heat energy in phase change of electrical insulation cooling liquid, bulky cooling device, and increased investment cost, etc., to achieve Save pumping power, reduce installation cost and save space
Pending Publication Date: 2021-08-13
XI AN JIAOTONG UNIV
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Problems solved by technology
[0004] However, this submerged phase-change cooling method requires additional pump power to drive water circulation, and the cooling device is bulky, which requires space and increases investment costs. A large amount of heat energy generated by the phase change of the electrically insulating cooling liquid is wasted. Therefore, it is also necessary to adapt to the small size of electronic devices. In response to the development trend of globalization and integration, in response to the call of "carbon neutrality" and "carbon peak", further improve the immersion phase change cooling system
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[0074] see Figure 1 to Figure 4 , a waste heat recovery type submerged phase change cooling system, including a cavity 1, a simulated heat source 2, an electrically insulating cooling liquid 3, a metal cover plate 4, a heat pipe radiator 7, a scale plate radiator 8, a motor 9, and a metal bracket 10 , fan blade 11 and semiconductor thermoelectric power generation sheet 12.
[0075] Wherein, the simulated heat source 2 is a heating element, and the simulated heat source 2 is placed inside the cavity 1 and completely immersed in the electrically insulating cooling liquid 3 . The metal cover plate 4 covers the cavity 1, and the connection is strictly sealed around it. The scaly flat radiator 8 is fixedly installed on the metal cover plate 4 , and the rib part is located inside the cavity 1 to collect heat, and the flat part is located outside the cavity 1 . The heat pipe radiator 7 is placed above the scale plate radiator 8 . The semiconductor thermoelectric power generation ...
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The invention relates to a waste heat recovery type immersed phase change cooling system combined with a heat pipe. A waste heat recovery type immersed phase change cooling system comprises a first cooling device and further comprises a second cooling device, an energy recovery device and a third cooling device. The first cooling device is used for carrying out heat exchange on a heating element; the second cooling device is used for enhancing heat dissipation of the first cooling device, the energy recovery device recovers heat absorbed by the first cooling device and then provides a power source for the third cooling device, and the third cooling device is used for enhancing heat dissipation of the first cooling device and the second cooling device. The invention provides a waste heat recovery type immersed phase change cooling system which has the advantages of small size, good temperature uniformity, efficient heat dissipation, graded cooling, waste heat recovery, low energy consumption and the like, and is suitable for cooling electronic devices, especially small electronic equipment, such as heating parts in a computer system.
Description
technical field [0001] The invention relates to a waste heat recovery submerged phase change cooling system combined with a heat pipe. Background technique [0002] In recent years, with the rapid development of electronic technology, the use of high-performance chips and integrated circuits has become more and more widespread, and the power of electronic chips has become larger and larger, but their volume has gradually decreased. In this case, the power consumption and calorific value per unit area of the electronic chip increase sharply, and the current chip heat flux density has reached 300W / cm 2 . If such a large amount of heat cannot be dissipated in time, the temperature of the electronic device will continue to rise, which will seriously affect the stability and life of the electronic device. According to statistics, more than 55% of electronic device failures are caused by high temperature, while traditional air cooling and water cooling cannot meet the heat dis...
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IPC IPC(8): G06F1/20F28D15/02
CPCF28D15/02G06F1/20G06F2200/201Y02D10/00
Inventor 刘秀芳侯予李佳靖王宇涛钟富豪杨朔陈佳军苗庆硕刘一鸣
Owner XI AN JIAOTONG UNIV