Smooth rectangular soldering tin sheet preparation system and preparation method

A technology for preparing a system and a solder sheet, which is applied in the direction of metal extrusion dies, etc., can solve the problem that the solder sheet cannot reach a complete plane, etc., so as to reduce personnel requirements and industrial safety incidents, reduce oxide production, and improve the stability of parts. Effect

Pending Publication Date: 2021-08-31
铭觉电子科技(苏州)有限公司
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Problems solved by technology

[0003] For this reason, the embodiment of the present invention provides a flat rectangular solder sheet preparation syste

Method used

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  • Smooth rectangular soldering tin sheet preparation system and preparation method
  • Smooth rectangular soldering tin sheet preparation system and preparation method
  • Smooth rectangular soldering tin sheet preparation system and preparation method

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[0030] Example

[0031] like figure 1 and figure 2 As shown, the present invention provides a flat rectangular solder sheet preparation system, including a pushing mechanism 1 , a heating device 2 , a rectangular hole die 3 and a shearing mechanism 4 arranged in sequence from left to right. The heating device 2 is provided with a feeding port on the side of the pushing mechanism 1 for placing the tin column into the softening. The rectangular hole mold 3 is fixed on the heating device 2, and a discharge port is provided on the rectangular hole mold 3 on the side of the shearing mechanism 4, and the discharge port and the feed port are arranged in communication. The pushing mechanism 1 includes an extrusion shaft 11 that pushes the tin column from the heating device 2 to the rectangular hole die 3 . Between the heating device 2 and the shearing mechanism 4 , a feeding mechanism 5 for guiding the formed rectangular solder wire to the shearing mechanism 4 is also provided. T...

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Abstract

The embodiment of the invention discloses a smooth rectangular soldering tin sheet preparation system and a preparation method. The preparation system comprises a pushing and extruding mechanism, a heating device, a rectangular hole mold and a shearing mechanism which are sequentially arranged from left to right, wherein a feeding port for placing a tin column for micro-softening is formed in the portion, on the pushing and extruding mechanism side, of the heating device, the rectangular hole mold is fixed to the heating device, a discharging port is formed in the side, on the shearing mechanism, of the rectangular hole die, the discharging port is communicated with the feeding port; the pushing and extruding mechanism comprises an extruding shaft for extruding the tin column from the heating device to the rectangular hole die, wherein a feeding mechanism for guiding a formed rectangular tin welding wire to the shearing mechanism is further arranged between the heating device and the shearing mechanism. According to the invention, a tin material is heated to a micro-softening stage, extrusion forming is carried out by the pushing mechanism and the rectangular hole mold, and in addition, automatic cutting and connecting production is carried out by combining the shearing mechanism, so that a phenomenon of uneven appearance of a soldering tin sheet caused by the existing production mode is improved, and the piece placing stability of SMT equipment during production is improved.

Description

technical field [0001] The embodiments of the present invention relate to the technical field of solder wire forming, and in particular to a preparation system and method for a flat rectangular solder sheet. Background technique [0002] Solder sheets are tin sheets used for soldering. As far as the existing production technology equipment is concerned, mold casting and stamping are mainly used in the production of solder sheets. However, no matter whether casting or stamping is used, there is a defect that the complete plane of the solder sheet cannot be reached. Contents of the invention [0003] Therefore, embodiments of the present invention provide a flat rectangular solder sheet preparation system and a preparation method to solve the problem that the solder sheet prepared in the prior art cannot reach a complete plane. [0004] In order to achieve the above purpose, embodiments of the present invention provide the following technical solutions: [0005] According...

Claims

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Application Information

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IPC IPC(8): B21C23/18B21C25/02B21C29/00B21C35/02B21C35/04
CPCB21C23/18B21C25/02B21C29/003B21C35/02B21C35/04
Inventor 徐伟松
Owner 铭觉电子科技(苏州)有限公司
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