Smooth rectangular soldering tin sheet preparation system and preparation method

Abstract

The embodiment of the invention discloses a smooth rectangular soldering tin sheet preparation system and a preparation method. The preparation system comprises a pushing and extruding mechanism, a heating device, a rectangular hole mold and a shearing mechanism which are sequentially arranged from left to right, wherein a feeding port for placing a tin column for micro-softening is formed in the portion, on the pushing and extruding mechanism side, of the heating device, the rectangular hole mold is fixed to the heating device, a discharging port is formed in the side, on the shearing mechanism, of the rectangular hole die, the discharging port is communicated with the feeding port; the pushing and extruding mechanism comprises an extruding shaft for extruding the tin column from the heating device to the rectangular hole die, wherein a feeding mechanism for guiding a formed rectangular tin welding wire to the shearing mechanism is further arranged between the heating device and the shearing mechanism. According to the invention, a tin material is heated to a micro-softening stage, extrusion forming is carried out by the pushing mechanism and the rectangular hole mold, and in addition, automatic cutting and connecting production is carried out by combining the shearing mechanism, so that a phenomenon of uneven appearance of a soldering tin sheet caused by the existing production mode is improved, and the piece placing stability of SMT equipment during production is improved.

Description

technical field [0001] The embodiments of the present invention relate to the technical field of solder wire forming, and in particular to a preparation system and method for a flat rectangular solder sheet. Background technique [0002] Solder sheets are tin sheets used for soldering. As far as the existing production technology equipment is concerned, mold casting and stamping are mainly used in the production of solder sheets. However, no matter whether casting or stamping is used, there is a defect that the complete plane of the solder sheet cannot be reached. Contents of the invention [0003] Therefore, embodiments of the present invention provide a flat rectangular solder sheet preparation system and a preparation method to solve the problem that the solder sheet prepared in the prior art cannot reach a complete plane. [0004] In order to achieve the above purpose, embodiments of the present invention provide the following technical solutions: [0005] According...

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Problems solved by technology

[0003] For this reason, the embodiment of the present invention provides a flat rectangular solder sheet preparation system and preparation method to solve the problem that the solder sheet prepared in the prior art cannot reach a complete plane

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