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Electronic device module having heat radiating portion and manufacturing method thereof

A technology of electronic devices and heat radiation parts, which is applied to electronic device modules with heat radiation parts and its manufacturing field, and can solve problems such as damage

Pending Publication Date: 2021-10-22
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When it is not possible to effectively radiate heat generated by electronic devices, there may be a problem that parts of electronic device modules sealed with peripheral components or electronic devices may be damaged

Method used

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  • Electronic device module having heat radiating portion and manufacturing method thereof
  • Electronic device module having heat radiating portion and manufacturing method thereof
  • Electronic device module having heat radiating portion and manufacturing method thereof

Examples

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Embodiment Construction

[0037] The following detailed description is provided to assist the reader in gaining an overall understanding of the methods, devices and / or systems described herein. However, various changes, modifications and equivalents of the methods, apparatus and / or systems described herein will be apparent after understanding the disclosure of the present application. For example, the order of operations described herein is an example only and is not limited to the order set forth herein, but changes may be made that will be apparent after understanding the disclosure of this application, except for operations that must occur in a specific order. . Furthermore, descriptions of features known in the art may be omitted for increased clarity and conciseness.

[0038] The features described herein may be embodied in different forms and should not be construed as limited to the examples described herein. Rather, the examples described herein have been provided merely to illustrate some of...

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Abstract

An electronic device module includes: a substrate; a heating element mounted on a first surface of the substrate; a heat radiating portion coupled to one surface of the heating element; a signal transmission portion mounted on the first surface of the substrate and configured to electrically connect the substrate externally; and a sealing portion sealing the heating element, the heat radiating portion, and the signal transmission portion. The heat radiating portion includes: a heat transfer portion having an area larger than an area of the heating element; and a heat release portion protruding from one surface of the heat transfer portion. The heat release portion has an area smaller than the area of the heat transfer portion and has an exposed surface coplanar with an external surface of the sealing portion.

Description

[0001] This application claims the benefit of priority of Korean Patent Application No. 10-2020-0048274 filed with the Korean Intellectual Property Office on April 21, 2020, the entire disclosure of which is incorporated by reference for all purposes here. technical field [0002] The following description relates to an electronic device module having a heat radiation portion and a method of manufacturing the electronic device module. Background technique [0003] Recently, in semiconductor devices, electrode pad pitches have been gradually refined due to miniaturization of process technology and diversification of functions along with reduction in chip size and increase in the number of input / output terminals, and with each To accelerate the convergence of these functions, packaging technologies are needed to integrate various devices into a single package. [0004] In addition to the demand for technological improvement, stacked electronic device modules in which multiple...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367H01L23/31H01L21/50H01L21/56
CPCH01L23/367H01L23/3114H01L21/50H01L21/563H01L23/4334H01L23/49811H01L23/49833H01L23/49827H01L2924/181H01L2224/16225H01L2224/73204H01L2224/32225H01L2224/73253H01L2924/15174H01L2224/97H01L2924/00012H01L2924/00H01L23/49816H01L21/4882H01L21/4857H01L21/486H01L23/3121
Inventor 张丁睦
Owner SAMSUNG ELECTRO MECHANICS CO LTD