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Material receiving module and separate stripping device

A single-device, material-mold technology, applied in conveyor control devices, packaging, transportation and packaging, etc., can solve problems such as wafer damage

Pending Publication Date: 2021-11-09
HANGZHOU CHANGCHUAN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the preparation process of existing electronic devices, especially chips, the wafers of chips are separated from multiple wafer modules with films, which has always been a difficult problem in this industry.
The existing mechanical structure that separates the wafers is very easy to cause damage to the wafers

Method used

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  • Material receiving module and separate stripping device
  • Material receiving module and separate stripping device
  • Material receiving module and separate stripping device

Examples

Experimental program
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Embodiment Construction

[0062] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be understood that the specific embodiments described here are only used to explain the present invention, and do not limit the protection scope of the present invention.

[0063] It should be noted that when a component is said to be "mounted on" another component, it can be directly on the other component or there can also be an intervening component. When a component is said to be "set on" another component, it may be set directly on the other component or there may be an intervening component at the same time. When a component is said to be "fixed" to another component, it may be directly fixed to the other component or there may be an intervening component at the same time. The terms "vertical," "horizontal," "left...

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PUM

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Abstract

The invention relates to a material receiving module and a separate stripping device. The material receiving module is used for receiving and separating a to-be-separated material in a material assembly, and comprises a material receiving mechanism and a suction separate stripping mechanism, wherein the material receiving mechanism comprises a material receiving platform, the material receiving platform is movably arranged on a rack of the separate stripping device; and the material receiving platform moves relative to the rack and is aligned with the to-be-separated material, the suction separate stripping mechanism is used for extracting air from the material receiving platform and fixing the to-be-separated material to the material receiving platform, and the material receiving platform is used for receiving the material.

Description

technical field [0001] The invention relates to the field of electronic device manufacturing, in particular to a material receiving module and a single stripping device. Background technique [0002] Electronic devices belong to the field of precision device manufacturing, and all-round automation has always been a development discovery in the field of precision manufacturing. However, in the manufacturing process of existing electronic devices, especially chips, the chip wafers are separated from multiple wafer modules with films, which has always been a difficult problem in this industry. The existing mechanical structure for separately peeling off the wafer is very easy to cause damage to the wafer. Contents of the invention [0003] Based on this, it is necessary to provide an improved splicing module and a stripping device for the above-mentioned problems. The adsorption and stripping mechanism of the material receiving module absorbs the material by pumping air, wh...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65B69/00B65G35/00B65G43/08B65G47/24
CPCB65B69/0008B65G35/00B65G43/08B65G47/24B65G2201/02B65G2203/042
Inventor 张铮杨锋王元杰章华荣
Owner HANGZHOU CHANGCHUAN TECH CO LTD