Inter-board vertical interconnection structure

Abstract

The invention provides an inter-board vertical interconnection structure, which comprises a metal frame, fuzz buttons, dielectric cylinders and an outer conductor, the metal frame is provided with a mounting hole, the dielectric cylinders are arranged in the mounting hole, the dielectric cylinders are internally provided with through holes for mounting the fuzz buttons, the fuzz buttons are arranged in the through holes, and the outer conductor is arranged on the metal frame. The tubular outer conductor sleeves the dielectric cylinder and is located between the dielectric cylinder and the metal frame, and the edges of the two sides of the outer conductor are provided with folding edges bent outwards and a plurality of openings extending in the axis direction of the outer conductor; when the inter-board vertical interconnection structure is connected with bonding pads of two parallel printed boards, the edge of the outer conductor and the fuzz buttons can elastically deform to be in contact with the bonding pads of the two printed boards. Compared with a transmission structure in which a circle of grounding fuzz button mounting holes are drilled in an isolation frame, the inter-board vertical interconnection structure has the advantages that the structure size can be reduced, and the microwave transmission performance is better on the basis of realizing coaxial transmission.

Description

technical field [0001] The application belongs to the technical field of microwave circuits, and in particular relates to a vertical interconnection structure between boards. Background technique [0002] Three-dimensional stacked packaging is a relatively advanced packaging technology, which allows multiple chips to be stacked in a single package, thereby doubling the number of chips. A large number of three-dimensional stack packages have been used in microwave modules, but the microwave vertical interconnection between printed boards inside the microwave module is a difficult point in the process of three-dimensional stacking. [0003] In the prior art, fur buttons 13, dielectric columns 12 and metal frames 11 are usually used to form the inter-board coaxial transmission structure 10, such as Figure 4 shown. The structure is to set a medium hole on the metal frame 11, and then set a plurality of small holes in a circle on the periphery of the medium hole. A medium colum...

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Problems solved by technology

[0004] In addition, the overall size of the coaxial transmission structure 10 is relatively large due to the size limitation of the fur buttons 13 and the metal frame 11 on the outer ring; in addition, due to the uncertainty of the contact point between the metal frame and the printed board, Establish a model consistent with the actual situation for simulation optimization, resulting in uneven microwave transmission performance of each vertical interconnection structure, go

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