Laser chip and optical module

A chip and laser technology, applied in the field of communication, can solve the problems of not being able to achieve high signal modulation speed, not being able to meet the transmission requirements of 10 kilometers, and not being able to integrate wavelength adjustment functions, etc., to achieve the effect of improving signal modulation speed and excellent transmission performance

Pending Publication Date: 2022-03-08
HISENSE BROADBAND MULTIMEDIA TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

High-speed, high-integration, and wavelength-tunable light sources have always been a research hotspot in the industry, and laser chips integrated with electro-absorption modulators have emerged. There are technical problems in laser chips integrated with

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  • Laser chip and optical module
  • Laser chip and optical module
  • Laser chip and optical module

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Embodiment Construction

[0021] The technical solutions in some embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are only some of the embodiments of the present disclosure, not all of them. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments provided in the present disclosure belong to the protection scope of the present disclosure.

[0022] Throughout the specification and claims, unless the context requires otherwise, the term "comprise" and other forms such as the third person singular "comprises" and the present participle "comprising" are used Interpreted as the meaning of openness and inclusion, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific examples" example)" or "some examples" and the like are intended...

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Abstract

In the laser chip and the optical module provided by the invention, the laser chip is integrated with the gain region, the grating region and the electric absorption modulation region, the gain region generates the light beam, and the grating region performs wavelength tuning on the light beam; the quantum well of the electric absorption modulation region has a special structural design, so that excellent transmission performance is ensured, and the signal modulation speed is further improved; silicon dioxide layers are filled between the quantum well substrate layer and the metal electrode, between the reset layer and the metal electrode and between the quantum well top layer and the metal electrode; according to the embodiment of the invention, the electric absorption modulation region is specially designed to realize the 25G signal modulation speed and meet the requirement for the transmission distance of 10 kilometers. Therefore, the laser chip in the embodiment of the invention is a chip integrating gain, wavelength adjustability and electric signal modulation functions.

Description

technical field [0001] The present application relates to the technical field of communications, and in particular to a laser chip and an optical module. Background technique [0002] In today's optical fiber transmission systems, the requirements for light sources are getting higher and higher. High-speed, high-integration, and wavelength-tunable light sources have always been a research hotspot in the industry, and laser chips integrated with electro-absorption modulators have emerged. There are technical problems in laser chips integrated with electro-absorption modulators: one , the signal modulation speed is basically at 10G, which cannot reach the high signal modulation speed of 25G, and thus cannot meet the transmission requirements of 10 kilometers. Simultaneous activation and maintenance. Contents of the invention [0003] The embodiment of the present application provides a laser chip and an optical module. By integrating the gain, adjustable wavelength, and el...

Claims

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Application Information

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IPC IPC(8): H01S5/06H01S5/00G02B6/42
CPCH01S5/0601H01S5/0085G02B6/42
Inventor 梁海波章力明马军涛吴名忠
Owner HISENSE BROADBAND MULTIMEDIA TECH
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