Mobile phone mainboard applying limiting and damping technology

Abstract

The invention discloses a mobile phone main board applying a limiting and damping technology, which comprises a first main board and a second main board, a limiting mounting mechanism is arranged in a mounting hole of the first main board, a damping clamping mechanism is clamped at the outer edge of the first main board, and a damping connecting mechanism is also arranged between the first main board and the second main board. Through the arrangement of the limiting mounting mechanism, elastic limiting is realized through the two compression springs, that is, when the mobile phone is impacted at any angle, the damping springs can absorb energy and shock; the damping clamping mechanism is installed, and the two limiting supporting feet are arranged at the two ends of the torsional spring in a staggered mode, that is, when a mobile phone is vertically impacted, the limiting supporting feet are stressed preferentially, energy is absorbed through the torsional spring, and further protection of a mobile phone mainboard is achieved; the silica gel column and the damping connecting mechanism are arranged, when the mobile phone using the double-layer main board is impacted, the damping connecting mechanism is connected with the tension spring of the annular side wall through the columnar protrusion, and damping limiting between the two main boards is achieved.

Description

technical field [0001] The invention relates to the technical field of production of mobile phone main boards, in particular to a mobile phone main board using position-limiting and shock-absorbing technology. Background technique [0002] The mobile phone motherboard is composed of the baseband part responsible for encoding, the radio frequency processing part that realizes the signal receiving and releasing function, and other peripherals and memory connection parts. A typical motherboard can provide a series of junction points for processors, graphics cards, sound cards, Hard disk, memory, external equipment and other equipment joints. They are usually plugged directly into the relevant slots, or connected by wires. The most important building block on a motherboard is the chipset. The chipset is usually composed of North Bridge and South Bridge, and some are designed with single-chip microcomputer to enhance its performance. These chipsets provide a common platform fo...

AI Technical Summary

Problems solved by technology

[0003]The main board of the existing mobile phone is generally fixed by bolt pressing, and the rubber pad provides shock absorption. The effect is poor, so although it has rubber shock absorption, it is still easy to cause damage to the main board, and a large part of the existing mobile phones adopts a double main board superposition setting. When the main body of the mobile phone is impacted, the relative displacement between the two main boards Damage is also prone to occur, so a mobile phone motherboard with limit shock absorption technology is needed, especially for the working environment of dual motherboards

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