A thickness detection device for circuit board patch

Abstract

The invention discloses a thickness detection device for a circuit board patch, which relates to the field of thickness detection and includes a base, which is fixedly connected to a fixed side plate; the fixed side plate is provided with a conveying mechanism; The installation frame is fixedly connected to the thickness detection mechanism; the thickness detection mechanism is fixedly connected to the detection pressure roller mechanism; the installation frame is provided with an adjustment component, and the adjustment component includes a first transmission mechanism, a second transmission mechanism, a transmission rod mechanism and a telescopic mechanism, In the present invention, the circuit board can be conveyed by setting the conveying mechanism, so as to realize continuous detection, the center clamping of the circuit board can be ensured by setting the synchronous clamping mechanism, and the position of the detection roller mechanism can be recorded by setting the thickness detection mechanism. Thereby, the thickness of the circuit board patch and the thickness range are detected, which increases the efficiency of the thickness detection of the circuit board patch.

Description

technical field [0001] The invention relates to the field of thickness detection, in particular to a thickness detection device for a circuit board patch. Background technique [0002] Circuit board patch is also SMT patch, SMT is surface assembly technology, which is the most popular technology and process in the electronic assembly industry. It is a circuit assembly technology that mounts the leadless or short lead surface mount components on the surface of the printed circuit board or the surface of other substrates, and then solders and assembles them by reflow soldering or dip soldering. [0003] In the prior art, through the set operation table, connecting column, object board, rectangular hole, first slider, limit plate, side plate, bottom plate, sliding card plate, chute, second slider, sliding assembly and The lifting assembly can adjust the position of the sliding card plate up and down, so that the distance between one group of sliding card plates and the bottom ...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, through the set operation table, connecting column, loading plate, rectangular hole, first slider, limit plate, side plate, bottom plate, sliding clamping plate, chute, second slider, sliding assembly and The lifting component can adjust the position of the sliding pallets up and down, so that the distance between one set of sliding pallets and the bottom plate is the maximum value of the normal thickness range, and then the distance between the other set of sliding pallets and the bottom plate is the normal thickness The minimum value of the range, you only need to place the circuit board on the top of the loading board, and move the loading board horizontally so that the two ends of the circuit board move towards the two sets of bottom plates and the sliding card board respectively. When the thickness of the circuit board meets the normal value , one end of the circuit board can be inserted into a group where the distance between the sliding card board and the bottom plate is the maximum value of the normal thickness range, and the other end of the circuit board cannot be inserted into the distance between the sliding card board and the bottom plate is within the normal thickness range. On the contrary, when any end of the circuit board does not meet the above conditions, the thickness of the circuit board does not meet the specified normal range, and it is not necessary to repeatedly read the thickness value to determine whether the circuit board is qualified , but the existing technology cannot realize continuous and rapid detection of the thickness of circuit boards of different sizes, so the existing technology has a large room for improvement

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