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LED devices

A light-emitting diode and device technology, applied in the direction of electric solid-state devices, semiconductor devices, electrical components, etc., can solve the problem that LED devices cannot be used reliably

Inactive Publication Date: 2006-07-05
CITIZEN ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If such a change occurs repeatedly, the lead wire 20 will be broken and the LED device cannot be used reliably.

Method used

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Embodiment Construction

[0013] Referring to the 1st embodiment of the present invention figure 1 The LED1 device includes: a substrate 2 made of liquid crystal polymer and having a hemispherical groove 4; electrodes 11a, 11b; and an LED10 fixed to the electrodes 11a, 11b through bumps 6, 7. The inner wall of the groove 4 is coated with electrodes 11a, 11b, and the outer surface of each electrode is processed into a light reflecting surface 9 by silver plating. The lower surface of the LED 10 is sealed with a sealing resin 5 to increase resistance to moisture, impact and vibration, and to protect the bumps 6 and 7 .

[0014] The groove 4 is covered by a transparent sealing plate 3 to protect the LED 10 .

[0015] The liquid crystal polymer constituting the substrate 2 has excellent heat resistance and a small coefficient of expansion. Therefore, it is possible to reduce the influence of the heat generated by the reflow soldering method and the influence of the atmospheric temperature change.

[001...

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Abstract

A recess is formed in a substrate, a pair of electrodes is provided on the surface of the substrate including a surface of the recess. An LED is provided on the bottom of the recess. A transparent sealing plate is provided for closing the recess.

Description

technical field [0001] The present invention relates to light emitting diode (LED) devices used in electronic equipment such as mobile phones. Background technique [0002] Fig. 4 is a cross-sectional view showing a conventional LED device. The LED device 15 includes a substrate 25, a frame 18 made of resin and having a hemispherical groove 19, electrodes 17a and 17b embedded in the frame 18, and an LED 16 fastened to the electrode 17a. LED16 is connected to electrode 17a, 17b by lead wire 20. As shown in FIG. The inner wall 22 of the groove 19 is processed into a light reflecting surface 22 . The groove 19 is filled with a transparent resin 21 for sealing the LED. [0003] In the LED device 15, if water vapor exists in the transparent resin 21, the heat generated by the reflow soldering method will cause the water vapor to expand, so that the frame 18 will break. Also, the transparent resin 21 shrinks with changes in atmospheric temperature. If such changes occur repea...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00H01L33/58H01L33/60H01L33/62
CPCH01L33/46H01L33/486H01L2224/48091H01L2224/48227H01L33/60H01L2224/73204H01L2224/45144H01L2924/00014H01L2924/00
Inventor 堀内惠中村忍
Owner CITIZEN ELECTRONICS CO LTD