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Tin and silver co-crystal solder without lead against oxidation

A lead-free solder, anti-oxidation technology, used in welding/cutting media/materials, welding media, welding equipment, etc., can solve problems such as increasing costs, unable to fundamentally change the interaction between tin and air, and achieve antioxidant capacity. The effect of improving, small changes in basic physical properties, and easy to popularize and use

Inactive Publication Date: 2007-05-23
INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Undoubtedly, these technologies will greatly increase the cost, and since the main component of the oxide slag on the surface of the liquid solder alloy is tin oxide, the purification of the raw material cannot fundamentally change the interaction between the tin in the solder and the air, so there is It is necessary to seek new antioxidant technology

Method used

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  • Tin and silver co-crystal solder without lead against oxidation

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Arranged Ag 3.0%, P 0.06%, the rest is Sn-silver eutectic alloy, choose ordinary melting technology for alloying, get master alloy, and then put the master alloy in a crucible, heated and melted under atmospheric pressure until 250 ℃, scrape off the scum on the liquid surface, and keep it at this temperature for a long time to observe the change of the color of the liquid surface of the alloy melt to evaluate the effect of high temperature oxidation resistance of the alloy. It was found that the alloy can still keep the liquid surface bright after holding at 250 ℃ for 10 hours. After the alloy is cooled from high temperature to room temperature, the surface is bright and silver-white, indicating that the alloy has good oxidation resistance.

Embodiment 2

[0030] The tin-silver eutectic alloy with Ag 3.5%, Ge 0.02% and the rest is Sn, was tested according to the method of Example 1, and it was found that the alloy could still keep the liquid surface bright after holding at 250 ℃ for 10 hours. After the alloy is cooled from high temperature to room temperature, the surface is bright and silver-white, indicating that the alloy has good oxidation resistance.

Embodiment 3

[0032] The tin-silver eutectic alloy with Ag 3.8%, P 0.005%, Ge 0.005%, and the rest is Sn, is tested according to the method of Example 1, and it is found that the alloy can still keep the liquid surface bright after holding at 250 ° C for 5 hours. . After the alloy is cooled from high temperature to room temperature, the surface is bright and silver-white, indicating that the alloy has good oxidation resistance.

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Abstract

An antioxidizing lead-free eutectic Sn-Ag solder for microelectric industry contains Ag (3-4 wt%), Ge and / or P (0.003-0.08) and Sn (rest).

Description

Technical field: [0001] The invention relates to a solder alloy in the field of soldering, in particular to a Sn-Ag-X (wherein X refers to P, Ge or a compound thereof) alloy solder, which is used for metal-to-metal welding. Background technique: [0002] Soldering is a very old and practical technology, and the world consumes about 60,000 tons of solder alloys every year, mainly using tin-lead alloy based systems. Because tin-lead solder has good flowability on copper, copper alloy and steel, low melting point, good corrosion resistance, and has certain strength, good electrical conductivity, good mechanical properties and process properties, it is now widely used. Used in the electronics industry (accounting for more than 70% of solder consumption). This alloy has a long history of use, so it has accumulated a lot of production and practical application experience, and at the same time, the cost of raw materials is low and the resources are extensive. [0003] But studies...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26C22C13/00
Inventor 冼爱平郭建军尚建库
Owner INST OF METAL RESEARCH - CHINESE ACAD OF SCI