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Sn-Cu lead-free welding flux capable of resisting atmospheric corrosion

A technology of atmospheric corrosion resistance and lead-free solder, applied in the direction of welding/cutting medium/material, welding medium, welding equipment, etc., can solve the problems of poor corrosion resistance, reduce production costs, ensure alloy composition, and be easy to popularize and use Effect

Inactive Publication Date: 2012-05-30
INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the problem of poor surface corrosion resistance of the existing Sn-Cu solder in a corrosive atmospheric environment, the present invention provides a corrosion-resistant Sn-Cu solder, the main technical means of which is to add some trace Alloying elements to achieve the purpose of improving the atmospheric corrosion resistance of the alloy surface without changing the basic physical and mechanical properties of these Sn-Cu solders

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Use industrial No. 1 tin as raw material, add 0.7% Cu (weight percentage, the same below) and 0.02% Ga to prepare lead-free solder resistant to atmospheric corrosion. After heating and melting industrial pure tin and copper in a graphite crucible with a muffle furnace, add the proportion of the third component microalloying element Ga, dissolve, stir and homogenize, and then cast it in a small graphite plate with a diameter of Φ20mm , the height of the ingot is about 5mm. After cooling, the ingot with a bright surface is obtained. The sample is corroded with salt spray (spray once every 30 minutes). After 4 days, the surface still maintains a bright metal surface, which shows that the surface of the alloy has good corrosion resistance.

Embodiment 2

[0022] Using Sn-0.1%Cu alloy as raw material, adding 0.01%P, 0.01%Ni, using the method described in Example 1 to prepare and test, the obtained sample was corroded with salt spray (spray once every 30min), after 4 days, the surface remained It can keep the metal bright, and the alloy has good corrosion resistance.

Embodiment 3

[0024] Using Sn-1%Cu alloy as raw material, adding 0.02%Ge and 0.01%Si, using the method described in Example 1 to prepare and test, the obtained sample was corroded with salt spray (spray once every 30min), after 4 days, the surface remained It can keep the metal bright, and the alloy has good corrosion resistance.

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PUM

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Abstract

The invention aims to provide a corrosion-resisting Sn-Cu welding flux. A main technical means is that trace alloy elements are added to a common Sn-based alloy, so as to achieve the purpose of improving the atmospheric corrosion resistance of an alloy surface under the condition that the basic physical and mechanical properties of the Sn-Cu welding flux are not changed. In order to achieve the purpose, the invention provides a technical scheme that one or more of the trace alloy elements Ti, P, Ge, Si, Ni and Ga is / are added to the common Sn-Cu based alloy; the added volume by weight percent is 0.001-0.10%; and the common Sn-Cu based alloy is a Sn-Cu binary alloy which contains 0.10-1.5wt% of copper.

Description

technical field [0001] The invention relates to a Sn-based alloy resistant to atmospheric corrosion, in particular to a Sn-Cu-based lead-free solder added with trace elements. Background technique [0002] Soldering is an important connection technology. The soft solder alloys that consume about 60,000 tons per year in the world are mainly based on tin-lead alloys. Because this alloy has good welding performance on copper and copper alloys, it is widely used in the electronics industry (accounting for more than 70% of the world's solder consumption). However, lead is a toxic metal, and low doses of lead absorbed by the body can cause lead poisoning. Due to the large increase of waste electronic devices, the toxic component lead in tin-lead solder in the existing landfill treatment will be gradually corroded, dissolved, diffused and enriched by the aqueous solution in the natural environment, and will eventually cause unfavorable effects on the natural water body and its a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26
Inventor 冼爱平
Owner INST OF METAL RESEARCH - CHINESE ACAD OF SCI