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Oxidation resistant stannum-cuprum eutectic alloy leadless solder

A technology of lead-free solder and eutectic alloy, applied in the direction of welding/cutting medium/material, welding medium, welding equipment, etc., can solve the problem that the interaction between lead-free solder tin and air oxygen cannot be fundamentally improved, and the cost of alloy raw materials is high , the price is very expensive and other problems, to achieve the effects of easy promotion and use, low production cost, and improved antioxidant capacity

Inactive Publication Date: 2007-01-10
INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Obviously, these technologies will greatly increase the production cost, but since the main component of the oxidized slag on the surface of the liquid lead-free solder alloy is tin oxide, the purification of raw materials cannot fundamentally improve the oxygen balance between tin and air in the lead-free solder alloy. interact to form oxide slag
Chinese patent (CN85 1 00578 B) provides a method of adding an alloy of precious metal indium and rare earth elements to improve the oxidation resistance of tin-lead solder, but the price of indium is very expensive, and the raw material cost of the alloy is high, so it is difficult to be practical

Method used

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  • Oxidation resistant stannum-cuprum eutectic alloy leadless solder

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Experimental program
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Effect test

Embodiment 1

[0026] Configure Cu 0.7%, Ge 0.05%, and the rest is a tin-copper eutectic alloy of Sn, select the common melting technology for alloying, obtain the master alloy, then put the master alloy in an open crucible, heat and melt under atmospheric pressure until 250 ℃, scrape off the scum on the liquid surface, and keep warm at this temperature for a long time, observe the color change of the liquid surface of the alloy melt, so as to evaluate the effect of the alloy on high temperature oxidation resistance. It was found that the alloy can still keep the liquid surface bright when kept at 250°C for 5 hours. After the alloy is cooled from high temperature to room temperature, the surface is bright and silvery white, indicating that the alloy has good oxidation resistance.

Embodiment 2

[0028] Configuration Cu 0.7%, P 0.06%, the rest is the tin-copper eutectic alloy of Sn, carries out the test by the method for embodiment 1, finds that this alloy can still keep liquid level bright at 250 ℃ for 5 hours. After the alloy is cooled from high temperature to room temperature, the surface is bright and silvery white, indicating that the alloy has good oxidation resistance.

Embodiment 3

[0030] Configuration Cu 0.5%, Ge 0.01%, the rest is the tin-copper eutectic alloy of Sn, carries out the test by the method for embodiment 1, finds that at 250 ℃ for 5 hours, this alloy can still keep the liquid surface bright. After the alloy is cooled from high temperature to room temperature, the surface is bright and silvery white, indicating that the alloy has good oxidation resistance.

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Abstract

The invention relates to an oxidation resistant tin copper eutectic non-lead solder. Its alloy weight compositions are that Cu is from 0.4 percent to 1 percent; X is from 0.001 percent from 0.1 percent (the X is Ge and / or P), the surplus quantity are Sn and unavoidable impurity (all above is counted according to the weight percentage). The invention has the key property of the common tin copper eutectic non-lead solder, can apply to all sorts of the non-lead solder product, such as mother alloy, welding rod block, welding wire, mini-type solder ball, welding powder, soldering paste, especially suit to the electronic package technique in the micro electron industry. Compared with the common tin lead solder alloy, the alloy of the invention has no poison element lead; it is added micro alloy element Ge, P based on the tin copper eutectic alloy to improve the oxidation resistant ability of the liquid alloy at high temperature; it can widely apply in electronic industry and general purpose industry.

Description

technical field [0001] The invention relates to a lead-free solder alloy in the welding field, in particular to a Sn-Cu-X eutectic alloy type oxidation-resistant tin-copper alloy lead-free solder. Background technique [0002] Soldering is a very old and practical technology. The world's annual consumption of about 60,000 tons of solder alloys is mainly based on tin-lead alloys. Because tin-lead eutectic solder has good welding performance on copper and copper alloys, sufficient connection strength and good process performance, it is widely used in the electronics industry (accounting for more than 70% of the world's solder consumption). The use of tin-lead eutectic solder alloy has a long history, and a lot of practical application experience has been accumulated in production. At the same time, the cost of raw materials is low and the resources are extensive. However, lead is a toxic metal, and low doses of lead absorbed by the body can cause lead poisoning. At present, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26
Inventor 冼爱平郭建军尚建库
Owner INST OF METAL RESEARCH - CHINESE ACAD OF SCI