Projection exposure appts.

An exposure device and projection technology, applied in the field of projection exposure technology, can solve the problems of increased weight, difficulty in obtaining exposure resolution, and increased mask production costs, so as to improve productivity, reduce mask cost, and prevent self-weight deformation Effect

Inactive Publication Date: 2004-08-11
CANON KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] ①As the size of the substrate to be exposed increases, the size of the mask also increases, and the manufacturing cost of the mask increases
[0011] ②Because the mask becomes larger, it becomes difficult to obtain the required exposure resolution due to the bending caused by the mask's own weight in the exposure device
[0012] ③Enlarge and increase the weight of the entire exposure device
Therefore, it will be difficult to secure a production margin such as flatness on the exposed substrate side, and as a result, it will be difficult to obtain the required exposure resolution.

Method used

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  • Projection exposure appts.
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  • Projection exposure appts.

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] 1 shows a schematic configuration of a projection exposure apparatus (liquid crystal substrate exposure apparatus: lens projection type equal magnification scanning type exposure apparatus) used for a substrate for a liquid crystal display panel (semiconductor device) according to Example 1 of the present invention. In this liquid crystal substrate exposure apparatus, 4 is an exposure mask, and the shape of the mask pattern and the like will be described later. 1 is a mask stage, on which a mask 4 is placed, and is carried out in a direction (left and right direction in FIG. drive.

[0052] The projection lens 2 projects the light (exposure light beam) transmitted through the mask pattern of the mask 4 out of the illumination light irradiated on the mask 4 onto the substrate 3 to be exposed which is a glass substrate for a liquid crystal display panel. In addition, a photoresist as a photosensitive agent is coated on the surface of the exposed substrate 3 .

[0053] 5...

Embodiment 2

[0119] exist Figure 10 In (A), similar to the mask described in Embodiment 1, it shows that there are pixel mask patterns 14a, gate line mask patterns 14b, and driving mask patterns 14c, and at the same time, it shows that there are also masks for the exposed substrate 3. The joint mask patterns (third mask patterns) 14d and 14d' of the joint pattern (wiring pattern to each gate line pattern) which are individual patterns are exposed. In addition, in Figure 10 (B), enlarged representation Figure 10 Part B of (A).

[0120] In addition, in this embodiment, the joint mask patterns 14d and 14d' are set to have a width that is 2 times the pitch P of the pixel mask pattern 14a. Here, the connector mask pattern on the pixel mask pattern row 1L side is called a first connector mask pattern 14d, and the connector mask pattern on the left side of the pixel mask pattern row 5L side is called a second connector mask pattern 14d. '.

[0121] Furthermore, for the mask 14 used in thi...

Embodiment 3

[0168] Next, an example of a method of manufacturing a liquid crystal display panel (semiconductor device) using the projection exposure apparatus described in each of the above examples will be described.

[0169] exist Figure 16 In , a flow chart of manufacturing a liquid crystal display panel is shown. In this embodiment, in step S101 (array design process), the circuit design of the liquid crystal array is performed. In step S102 (mask manufacturing process), a mask having a mask pattern corresponding to a designed circuit is manufactured.

[0170] On the other hand, in step S103 (substrate manufacturing process), a glass substrate as a substrate to be exposed is manufactured. Step S104 (array manufacturing process) is called the so-called "pre-process". In step S102, using the prepared mask, the actual array circuit is formed on the glass substrate by photolithography.

[0171] In this step S104, the exposure process described in the first and second embodiments above i...

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PUM

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Abstract

A projection exposure apparatus with a small size and low cost suitable for repeated pattern exposure is disclosed. The apparatus comprises an illumination system which irradiates light to a mask including plural columns of a mask pattern for repeated exposure to a member to form plural columns of an exposure pattern, a projection system which projects light from the mask onto the member, an exposure stage which moves the member, and a mask stage which moves the mask. The light irradiation and step driving of the exposure stage for moving the member by a movement amount equal to n times a pitch of the columns of the exposure pattern are alternately performed. The mask is moved by a movement amount equal to n times a pitch of the columns of the mask pattern with step driving of the exposure stage in an early and later phases of the repeated exposure.

Description

technical field [0001] The present invention relates to a projection exposure technique for exposing and duplicating a mask (original plate) pattern of a photomask, a reticle, or the like while moving a member to be exposed in a predetermined direction. Background technique [0002] Figure 22 It shows a projection exposure apparatus (scanning exposure apparatus) for exposing a circuit pattern on a large substrate used for a liquid crystal display panel or the like. [0003] In the figure, 81 is a mask, 82 is a mask scanning stage, 83 is a projection optical system, 84 is a substrate scanning stage, and 85 is a substrate to be exposed. [0004] In this scanning exposure apparatus, when transferring a circuit pattern on a substrate 85 to be exposed, an exposure beam is irradiated from the direction of the arrow in the figure to a mask 81 corresponding to a photographic negative. The light transmitted through the mask pattern formed on the mask 81 forms an image of the mask p...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): G03F7/22G03F7/20H01L21/027
CPCG03F7/70066G03F7/70791G03F7/70475G03F7/70425G03F7/70291G03F7/70466G03F7/20
Inventor饭塚和央磯端純二田中信义
OwnerCANON KK