67 results about "Exposure technique" patented technology

The invention relates to the technical field of image exposure, in particular to an image exposure system of code scanning equipment. The system comprises a CMOS chip which is internally provided with an automatic exposure unit and is used for collecting images and counting the brightness mean value of each frame of image; wherein the CMOS chip acquires an image in a first mode in a stop stream state, and acquires an image in a second mode in a start stream state; and the processor is used for executing an automatic exposure algorithm on the brightness mean value corresponding to the last frame of image in the stop stream state to generate a corresponding exposure parameter, and then transmitting the exposure parameter to the CMOS chip as an initial exposure parameter when the CMOS chip exposes the first frame of image in the start stream state. In the stop stream state, the brightness statistics is performed through the low-resolution image, and the brightness mean value of the last frame of image is used as the exposure basis of the first frame of image in the start stream state, so that the number of image frames required by image convergence to exposure stability is remarkably reduced, and the code scanning response speed is improved.

The invention relates to the technical field of DMD device imaging exposure, in particular to a method for improving DMD digital photoetching smoothness based on a curvature dynamic fuzzy exposure technology, which comprises the following steps: selecting an exposure image to be processed; segmenting the exposure image to be processed to obtain a plurality of sub-images; calculating the slope of the sub-image, and designing a displacement path based on the slope; calculating local expansion of the sub-image based on the displacement path, and preprocessing the sub-image; and exposing the pre-processed sub-images to obtain a complete exposed image. According to the invention, a high-fidelity complex image can be effectively exposed.

The utility model provides a double-sided automatic exposure machine for wafer production, which relates to the technical field of wafer production, and comprises a box body, an exposure device arranged in the box body, an annular plate arranged in the box body, a driving mechanism arranged in the box body, a loader arranged above the annular plate, and a plurality of vertical plates fixedly arranged on the annular plate in a circumferential array manner, one side of each vertical plate is provided with a pressing plate, one side, facing the corresponding vertical plate, of each pressing plate is fixedly provided with two guide rods which are arranged at intervals, the guide rods penetrate through the vertical plates, the vertical plates are fixedly connected with springs, the other ends of the springs are fixedly connected to the pressing plates, and the loader is internally provided with a plurality of storage grooves which are distributed in a circumferential array mode. The double-sided exposure device is matched with the exposure of the exposure device, double-sided exposure can be performed on the wafer, and the double-sided exposure technology allows exposure of two surfaces of the wafer at the same time, so that the exposure times and the exposure time are greatly reduced, and the production efficiency is remarkably improved.

The invention provides an anti-turbulence long-distance pickup method and device and a readable storage medium. In the method, laser generated by a laser is regulated and controlled by a half-wave plate and transmitted light is transmitted and received to realize echo collection; reflected local oscillation light and echoes are processed by a series of optical elements, a digital micromirror device, a wavefront sensor, a deformable mirror and the like and then are subjected to coherent beam splitting in a polarization beam splitter to enter a coherent receiver, a calculation unit processes signals to obtain sound information, and meanwhile, the self-adaptive optical technology is used for resisting turbulence, and the single exposure technology is used for improving the frame rate. The device comprises a laser generation and modulation module, a signal acquisition and conduction module, a signal processing and restoration module, a self-adaptive optical correction module, a frame rate improvement adaptation module and the like. The invention solves the problems of short pickup distance, large turbulence influence and the like in the prior art, realizes long-distance turbulence-resistant pickup, and is suitable for the fields of public safety, criminal investigation and case handling and the like.

The invention relates to the technical field of photoetching exposure, and discloses a precision optimization method and system for a reel-to-reel high-precision projection type exposure machine, and the method comprises the steps: obtaining microscopic depth data, material vibration data and an exposure overlapping region; performing energy distribution analysis according to the microscopic depth data to obtain exposure energy distribution; performing frequency domain analysis according to the material vibration data to obtain vibration frequency domain characteristics; performing correlation calculation according to the exposure energy distribution and the vibration frequency domain characteristics to obtain a correlation influence matrix; performing energy accumulation analysis on the exposure overlapping area to obtain an overlapping correction factor; and performing exposure parameter optimization according to the overlap correction factor and the correlation influence matrix, and updating control parameters of the exposure machine. The method has the following effect that the working precision of the reel-to-reel projection type exposure machine can be improved.

Disclosed in the present application are a preparation method for an arrayed cascaded microlens group, an arrayed exposure apparatus, and the application of an arrayed cascaded microlens group. The preparation method comprises: applying a photoresist layer to a surface of a substrate; performing first underexposure in a first region, and performing second underexposure in a second region, wherein the first region and the second region have an overlapping portion but do not completely overlap, and the overlapping portion generates superimposed underexposure to form regional graded underexposure; performing development to form a regional photoresist pillar array; and transforming photoresist pillars into curved surfaces, and using the curved surfaces to perform patterned etching on the substrate to obtain an arrayed cascaded microlens group. The present application uses underexposure technology combined with regional superimposed exposure to directly perform regional exposure with different doses, ultimately preparing a wafer-level arrayed cascaded microlens group, and thus has the significant advantages of low cost, convenient operation, high preparation efficiency and high yield, and can be widely applied in the manufacturing processes of various imaging sensors, display devices and photovoltaic devices.

The invention discloses a selective exposure technical method which comprises the following steps: S1, unit plate marking: detecting a unit plate, and marking a groove mark on a scrapped area of the unit plate; s2, pattern transfer: separating the unit plates with scrap mark grooves, carrying out independent layering on the unit plates by exposure personnel, and then carrying out exposure processing on the unit plates; and S3, exposure processing: selecting an LDI machine or a single PCS negative film for selective exposure. According to the method, in the manufacturing process of the circuit board, the scrapped areas are identified uniformly after passing through the inspection stations, and selective exposure is carried out on the scrapped areas in the pattern transfer process, so that the waste of cost and efficiency on the scrapped units in the subsequent process of manufacturing the scrapped units is avoided.

The invention discloses a portable X-ray machine for measuring osteoporosis, and relates to the technical field of medical equipment.The X-ray machine adopts 18-26 V wide-range low-voltage power supply, primary boosting is performed through a full-bridge inverter circuit and a high-voltage transformer, secondary boosting is performed through a single-side CW voltage doubling rectifying circuit, the output voltage ranges from 30 kV to 80 kV, and the tube current ranges from 0.1 mA to 1 mA. A pseudo dual-energy imaging technology is introduced, low-energy and high-energy X-rays are used for imaging respectively, artifacts are reduced through continuous multi-image taking and contrast synthesis, and the imaging quality is improved. And the overexposure risk of the CCD camera is reduced by adopting an accurate dose control and delayed exposure technology. And a glue sealing insulation design and a split type structure are adopted, so that the equipment volume is reduced, and the portability is improved. Through integration of multiple technologies, the portable X-ray machine which is efficient, safe, capable of reducing measurement errors and radiation cost is provided, and the portable X-ray machine is suitable for osteoporosis detection.

The utility model discloses a lens device, and belongs to the technical field of exposure. The lens device comprises a collimating mirror assembly, a reflecting mirror assembly, a DMD assembly and a lens assembly, the collimating mirror assembly is assembled on the reflecting mirror assembly, the DMD assembly is assembled on the reflecting mirror assembly and can rotate relative to the reflecting mirror assembly, the lens assembly is assembled on the reflecting mirror assembly, and laser enters the reflecting mirror assembly after being processed by the collimating mirror assembly; and the light is reflected to the DMD assembly through the reflector assembly, is reflected to the lens assembly after being processed by the DMD assembly and is output after being processed by the lens assembly, and finally light spots can be output. The utility model further discloses exposure equipment which comprises the lens device. According to the utility model, the DMD assembly rotates relative to the reflection box so as to realize the adjustment of the light spot angle, and the device has the advantages of easy and convenient operation and the like.

The present invention relates to the field of DMD device imaging exposure technology, and particularly to a method for improving the smoothness of DMD digital lithography based on curvature dynamic blur exposure technology, including: selecting an exposure image to be processed; segmenting the exposure image to be processed to obtain a plurality of sub-images; calculating the slope of the sub-images, and designing a displacement path based on the slope; calculating the local dilation of the sub-images based on the displacement path, and preprocessing the sub-images; exposing the preprocessed sub-images to obtain a complete exposure image. The present invention can effectively expose complex images with high fidelity.

Disclosed in the present application are a preparation method for an arrayed cascaded microlens group, an arrayed exposure apparatus, and the application of an arrayed cascaded microlens group. The preparation method comprises: applying a photoresist layer to a surface of a substrate; performing first underexposure in a first region, and performing second underexposure in a second region, wherein the first region and the second region have an overlapping portion but do not completely overlap, and the overlapping portion generates superimposed underexposure to form regional graded underexposure; performing development to form a regional photoresist pillar array; and transforming photoresist pillars into curved surfaces, and using the curved surfaces to perform patterned etching on the substrate to obtain an arrayed cascaded microlens group. The present application uses underexposure technology combined with regional superimposed exposure to directly perform regional exposure with different doses, ultimately preparing a wafer-level arrayed cascaded microlens group, and thus has the significant advantages of low cost, convenient operation, high preparation efficiency and high yield, and can be widely applied in the manufacturing processes of various imaging sensors, display devices and photovoltaic devices.

The invention discloses an edge exposure device and an exposure method, and belongs to the technical field of edge exposure. The edge exposure device comprises a feeding assembly, a feeding mechanism is arranged on the inner side of the feeding assembly, a turnover frame is arranged on the side position of the feeding assembly, and exposure frames are connected to the two sides of the top of the turnover frame; according to the invention, in the whole clamping, adsorption and pull-down process, a torque sensor, a first pressure sensor and a tension sensor are integrated in the system, so that the clamping, adsorption and pull-down processes of the two exposure frames are integrated, and the clamping, adsorption and pull-down processes of the two exposure frames are integrated; the multi-sensing-module cooperative monitoring mechanism can accurately control the clamping force, the pushing force and the downward pulling force acting on the glass substrate in real time, so that the problems of upward arching, downward sinking or unstable positioning of the glass substrate caused by improper stress are fundamentally avoided; and the safety and the shape integrity of the thin and brittle substrate in the processing process are greatly guaranteed.

The utility model belongs to the technical field of X-ray exposure, in particular to X-ray exposure control equipment and an X-ray exposure system, which comprise an X-ray exposure control component, a display screen component is arranged at the top of the X-ray exposure control component, and the back of the X-ray exposure control component is electrically connected with a data line. The X-ray exposure control assembly comprises a control equipment table body, an electric telescopic rod, a control panel, a protective sliding plate, a sliding groove, a push-pull block and a magnet, the electric telescopic rod is installed in the control equipment table body, the top end of the electric telescopic rod is fixedly connected with the control panel, and the protective sliding plate is arranged at the top of the control panel. The side of the protective sliding plate is slidably connected with a sliding groove, and the top of the protective sliding plate is fixedly connected with a push-pull block. According to the X-ray machine, the control panel on the control equipment is protected, and meanwhile, the point-breaking type medical non-woven fabric is arranged, so that the X-ray machine main body is conveniently isolated and protected.

Image exposure in an ophthalmic microscope device is controlled by first recording a camera image with the camera of the microscope using first exposure parameters. Edge detection, e.g., based on convolution using a discrete differential operator, is then used to identify regions where the image has high and low edge densities. A brightness parameter of the camera image is calculated by weighing the pixel brightness in the regions with increased edge density more strongly than in the other regions. The brightness parameter is then used to control the exposure parameters of the microscope.

The present invention provides a method for tilt bonding of an off-chip light source and a silicon-based integrated progressive grating coupler, comprising: pre-treating a sample; evenly coating a layer of photoresist on the surface of the sample, and baking the coated sample; transferring a preset pattern to the photoresist layer on the surface of the sample by exposure technology; placing the exposed sample in a developer to dissolve excess photoresist; transferring the pattern of the photoresist layer to the surface of the silicon layer of the sample by etching; plating silicon dioxide as a covering layer on the sample by plasma enhanced chemical vapor deposition; preparing gallium-indium alloy liquid metal according to a preset ratio, assembling the gallium-indium alloy liquid metal on a bonding pad of an off-chip light source with graphene, and controlling the off-chip light source to form a preset input light angle; filling the remaining space when the off-chip light source is bonded to the sample with a matching refractive index liquid to obtain a progressive grating coupler. The grating coupler designed by the present invention has a compact structure and is easy to integrate.

The invention discloses a method for quickly detecting the state of an LDI device, and belongs to the technical field of PCB board exposure. A detection pattern containing M rows and N columns of matrix points is exposed by a software built-in tool, and the position of the exposure point is tested by an alignment camera to compare with the theoretical position, and the test data is automatically analyzed to detect whether there is a problem with the device, and quickly locate the problem point, such as whether there is a problem with the optical path, the positioning accuracy of the workpiece stage, the horizontal straightness, the YAW, etc., to save the time of shutdown inspection; further, by setting the matrix point to a solid circle or a ring, the detection of the correctness of the pattern and the alignment result of the pattern are respectively realized.

The invention provides a focal plane calibration method and device, computer equipment and a storage medium, and belongs to the technical field of digital exposure, and the focal plane calibration method comprises the steps: carrying out the image collection of a preset sample plate, and obtaining a target image; the target image comprises a plurality of first object groups arranged side by side along a first direction and a plurality of second object groups arranged side by side along a second direction; the preset sample plate comprises a plurality of test areas, and the target object in one test area is obtained by one-time exposure of exposure equipment; determining pixel position information corresponding to each target object according to the target image; based on the pixel position information of each target object, judging whether the exposure state of the target object is normal or defocused, and determining predicted focal plane heights respectively corresponding to different test areas according to a judgment result and pre-stored exposure heights corresponding to each first object group; based on each predicted focal plane height, calibration information of an optimal focal plane of the exposure apparatus is determined.

The present disclosure provides a technique for achieving exposure by light having a high degree of matching with respect to sensitivity characteristics of an electrophotographic photoreceptor in an electrophotographic device. An exposure head (12) of an electrophotographic device (1) has light-emitting elements arranged side by side in a first direction (X). Each light-emitting element has a light-emitting layer containing semiconductor particles, which emit incoherent light, between layered electrodes, and the light-emission wavelength of the light-emitting layer is shorter than the light-emission wavelength represented by the band gap energy of the bulk of the semiconductor.

The utility model discloses a patch component exposure machine with a positioning structure, which relates to the technical field of patch component exposure and comprises an exposure machine shell, a driving motor is mounted in the exposure machine shell, and the output end of the driving motor is connected with a conveying belt through a shaft rod. The positioning mechanism is arranged in the exposure machine shell and is positioned on the conveying belt; the positioning mechanism comprises a guide unit and a positioning unit; and the guide unit is used for guiding the movement of the positioning unit. According to the utility model, through the arrangement of the positioning mechanism, when the exposure machine carries out line printing on a surface-mounted component, after a material is placed on the conveying belt, the driving motor drives the material on the conveying belt to move into the exposure machine, and the conveying belt can drive the abutting plate on the outer side to approach the material while the material moves, so that the exposure machine can carry out line printing on the surface-mounted component. And the positioning device is in contact with the outer wall of the material for pushing and positioning, so that the purpose of synchronously positioning the surface-mounted components in the conveying process is achieved, and the working efficiency is further improved.

The invention discloses an exposure time adjusting method, which relates to the technical field of image exposure, and comprises the following steps: setting exposure time, exposing a current image based on the exposure time, and carrying out histogram statistics on the exposed image to obtain a statistical result; respectively performing peak exposure calculation and mean exposure calculation based on the statistical result to obtain first adjustment time and second adjustment time; performing exposure weight calculation on the basis of the statistical result to obtain an adjustment weight, and performing weighted calculation on the first adjustment time and the second adjustment time on the basis of the adjustment weight to obtain pre-adjustment exposure time; and updating the exposure time based on the pre-adjusted exposure time, and exposing the next frame of image. The invention further discloses an exposure time adjusting device, computer equipment and a readable storage medium. According to the method, the exposure time is cooperatively adjusted through the peak value exposure algorithm and the mean value exposure algorithm in different scenes, so that the adjustment of the exposure time is more accurate.

The invention relates to the technical field of exposure, in particular to an LED exposure machine and method for manufacturing a printing plate, and the LED exposure machine for manufacturing the printing plate comprises a cabinet, two exposure assemblies, four guide rails, two tool assemblies, a mounting rack, a driving rotating shaft, a driven rotating shaft, a driving chain wheel, a driven chain wheel, a chain, two connecting blocks and a driving assembly; the two exposure assemblies can perform double-sided exposure on the PCB, the chain can drive the two tool assemblies to slide along the guide rails through the two connecting blocks, the sliding directions are opposite, and the two tool assemblies enter the cabinet alternately; when one tool assembly bears the PCB to be exposed in the cabinet, the other tool assembly completes feeding and discharging work outside the cabinet, in this way, in the same time period, feeding and discharging work and PCB exposure work are conducted at the same time, the time utilization rate is higher, and therefore the problems that an existing exposure machine wastes much time and is low in machining efficiency are solved.

The invention discloses a high-precision circuit board line exposure positioning calibration device, and relates to the technical field of circuit board line exposure, the high-precision circuit board line exposure positioning calibration device comprises a frame body and an exposure module, a top frame is arranged on one side of the top of the frame body, and a calibration assembly used for assisting optical calibration is installed in the top frame; and the calibration assembly comprises a sliding base, a second servo motor, a first lead screw, a threaded block, a second lead screw and a third servo motor, the second servo motor is arranged in the sliding base, and the first lead screw is installed at the output end of the second servo motor. According to the high-precision circuit board line exposure positioning calibration equipment, through the design of the driving adjusting assembly, the positions of the two limiting assemblies can be conveniently exchanged through rotation, a user can conveniently carry out single-face or double-face exposure treatment on a circuit board according to the use requirement, the situation that the user needs to manually adjust the exposure face during double-face exposure is avoided, and when double-face exposure is carried out, the operation is convenient. Wherein one group of limiting assemblies can be synchronously realized when moving downwards to feed the to-be-exposed circuit board.

The invention discloses an exposure device, an exposure system and an exposure method thereof, and relates to the technical field of exposure. The exposure device comprises a rack, a driving mechanism, a light-transmitting plate, a liquid dropping mechanism and a bearing disc, the bearing disc is installed on the rack, the driving mechanism is connected with the light-transmitting plate, the liquid dropping mechanism is installed on the light-transmitting plate, the light-transmitting plate is provided with a receding groove, and the light-transmitting plate and the bearing disc are arranged in a spaced mode; the liquid dropping mechanism is used for enabling the refraction liquid to penetrate through the receding groove and drop onto the bearing disc, the bearing disc is used for bearing the glass sheet, the liquid dropping mechanism is further used for enabling the refraction liquid to penetrate through the receding groove and drop onto the glass sheet, and the driving mechanism is used for driving the light-transmitting plate to be pressed on the glass sheet. The exposure device provided by the invention can cancel a polishing process, is time-saving and labor-saving, shortens the exposure period, improves the exposure efficiency, reduces the exposure cost and improves the economic benefit.

The present invention provides an anti-turbulence long-distance sound pickup method, device and readable storage medium thereof. In the method, a laser generates laser light, which is regulated by a half-wave plate. The transmitted light is used for transceiver to realize echo acquisition. The reflected local oscillator light and the echo are processed by a series of optical elements, a digital micromirror device, a wavefront sensor, a deformable mirror, etc., and then are coherently split by a polarization beam splitter and enter a coherent receiver. A calculation unit processes the signal to obtain sound information. At the same time, adaptive optical technology is used to resist turbulence, and single-exposure technology is used to improve the frame rate. The device includes modules such as laser generation and modulation, signal acquisition and conduction, signal processing and restoration, adaptive optical correction, and frame rate improvement adaptation. The present invention solves the problems of short sound pickup distance and large influence of turbulence in the prior art, realizes long-distance anti-turbulence sound pickup, and is applicable to fields such as public safety and criminal investigation.

The utility model discloses a mask plate and an exposure device, and relates to the technical field of exposure. The mask comprises a substrate, a shading layer, a conductive coating and a protective coating. The light shielding layer, the conductive plating layer and the protective plating layer are sequentially arranged on the substrate, the light shielding layer comprises a pattern area and a frame area, the frame area is arranged outside the pattern area in a surrounding mode, the conductive plating layer and the protective plating layer are transparent, and the protective plating layer is used for protecting the conductive plating layer and the light shielding layer; and the conductive plating layer is conducted with the pattern area and / or the frame area at the same time so as to prevent the shading layer from being damaged by static electricity. Compared with the prior art, the mask plate provided by the utility model adopts the conductive plating layer arranged outside the light shielding layer and the protective plating layer arranged outside the conductive plating layer, so that the mask plate has good wear resistance and electrostatic shock resistance, can effectively avoid wear and damage of the light shielding layer caused by electrostatic shock, and prolongs the service life.

Various embodiments herein relate to methods of using maskless lithography to form layers. In these embodiments, the method implements a dose-varying staircase that divides a geometry into overlay portions. The overlay portions can include different doses for each portion to achieve control of the taper. The taper can be achieved by operating the geometric "mask data" into different dose overlay portions controlled by a pixel blending (PB) exposure technique. To perform the methods described herein, a maskless lithography tool is used. The maskless lithography tool includes a controller that performs software-based "mask data" operations. Because the method is performed masklessly by software without the additional mask cost and manufacturing time, there is greater flexibility to adjust the taper angle and / or photoresist thickness residuals of multi-tone / grey-tone mask features, which is an advantage over traditional lithography methods that use masks.

The utility model discloses an exposure device for circuit board surface pattern manufacturing, and particularly relates to the technical field of circuit board surface pattern manufacturing exposure, which comprises a placing table, and a circuit board surface pattern manufacturing exposure auxiliary device is arranged at the upper end of the placing table. The circuit board surface pattern manufacturing exposure auxiliary device comprises an exposure assembly and a moving and transferring assembly. Compared with the prior art, the exposure device for manufacturing the surface pattern of the circuit board has the advantages that after the upper exposure machine body and the lower exposure machine body complete exposure of the circuit board, the upper exposure glass frame and the lower exposure glass frame continuously move to the upper end of the material placing table to wait for subsequent processing work of a worker; according to the device, the circuit board is subjected to fixed and movable exposure work through simple feeding and discharging, the feeding and discharging exposure efficiency of the whole device is greatly improved, meanwhile, the operation difficulty of the whole device is further reduced, and the applicability and the use stability of the whole device are effectively enhanced.

The utility model provides an exposure device and belongs to the technical field of exposure. The exposure device comprises a workbench, a plurality of marker lamp assemblies, a plurality of auxiliary lamp assemblies, a visual assembly and an exposure assembly. Wherein the workbench comprises a preset area for placing a workpiece to be exposed; the plurality of marker lamp assemblies are arranged in a preset area, and mark points are formed on the reverse side of the to-be-exposed workpiece when the front side of the to-be-exposed workpiece is exposed; the auxiliary lamp assemblies are all arranged outside the preset area, each auxiliary lamp assembly corresponds to the corresponding marking lamp assembly, and the visual assembly is used for identifying the marking lamps, the auxiliary lamps and the marking points and speculating the correction positions of the marking points according to the relation among the marking lamps, the auxiliary lamps and the marking points. And finally, exposing the reverse side of the to-be-exposed workpiece according to the corrected mark point through the exposure assembly. The exposure device disclosed by the utility model can ensure that the relative position relation of the exposure patterns on the front and back surfaces of the workpiece to be exposed is a determined value on the premise of not stopping the exposure work, so that the production efficiency is improved.

The utility model relates to the technical field of wafer exposure, and discloses a wafer exposure device which comprises a base, a support frame is fixedly arranged on the base, an exposure tube used for wafer P I exposure is fixedly arranged at the bottom of one end of the support frame, a wafer disc assembly used for fixing a wafer is arranged on the base, and the wafer disc assembly is fixedly arranged on the base. The exposure tube is sleeved with an exposure assembly used for performing secondary exposure on an invalid area at the edge of the wafer P I, and the exposure assembly is provided with a fixing assembly capable of fixing the exposure assembly at any position; by arranging the exposure assembly and the fixing assembly, after the wafer P I is subjected to overall exposure by using the exposure tube for the first time, the exposure assembly is slid and fixed by using the fixing assembly, and then the exposure assembly is started to perform secondary exposure on the invalid region of the edge of the wafer, so that the P I in the invalid region cannot be displayed by a developing solution, and the edge is kept flat; therefore, when the thick glue PR is coated, the thick glue can not enter a gap of the P I.