36 results about "Exposure technique" patented technology

The invention relates to the technical field of image exposure, in particular to an image exposure system of code scanning equipment. The system comprises a CMOS chip which is internally provided with an automatic exposure unit and is used for collecting images and counting the brightness mean value of each frame of image; wherein the CMOS chip acquires an image in a first mode in a stop stream state, and acquires an image in a second mode in a start stream state; and the processor is used for executing an automatic exposure algorithm on the brightness mean value corresponding to the last frame of image in the stop stream state to generate a corresponding exposure parameter, and then transmitting the exposure parameter to the CMOS chip as an initial exposure parameter when the CMOS chip exposes the first frame of image in the start stream state. In the stop stream state, the brightness statistics is performed through the low-resolution image, and the brightness mean value of the last frame of image is used as the exposure basis of the first frame of image in the start stream state, so that the number of image frames required by image convergence to exposure stability is remarkably reduced, and the code scanning response speed is improved.

Disclosed in the present application are a preparation method for an arrayed cascaded microlens group, an arrayed exposure apparatus, and the application of an arrayed cascaded microlens group. The preparation method comprises: applying a photoresist layer to a surface of a substrate; performing first underexposure in a first region, and performing second underexposure in a second region, wherein the first region and the second region have an overlapping portion but do not completely overlap, and the overlapping portion generates superimposed underexposure to form regional graded underexposure; performing development to form a regional photoresist pillar array; and transforming photoresist pillars into curved surfaces, and using the curved surfaces to perform patterned etching on the substrate to obtain an arrayed cascaded microlens group. The present application uses underexposure technology combined with regional superimposed exposure to directly perform regional exposure with different doses, ultimately preparing a wafer-level arrayed cascaded microlens group, and thus has the significant advantages of low cost, convenient operation, high preparation efficiency and high yield, and can be widely applied in the manufacturing processes of various imaging sensors, display devices and photovoltaic devices.

The utility model discloses a lens device, and belongs to the technical field of exposure. The lens device comprises a collimating mirror assembly, a reflecting mirror assembly, a DMD assembly and a lens assembly, the collimating mirror assembly is assembled on the reflecting mirror assembly, the DMD assembly is assembled on the reflecting mirror assembly and can rotate relative to the reflecting mirror assembly, the lens assembly is assembled on the reflecting mirror assembly, and laser enters the reflecting mirror assembly after being processed by the collimating mirror assembly; and the light is reflected to the DMD assembly through the reflector assembly, is reflected to the lens assembly after being processed by the DMD assembly and is output after being processed by the lens assembly, and finally light spots can be output. The utility model further discloses exposure equipment which comprises the lens device. According to the utility model, the DMD assembly rotates relative to the reflection box so as to realize the adjustment of the light spot angle, and the device has the advantages of easy and convenient operation and the like.

Disclosed in the present application are a preparation method for an arrayed cascaded microlens group, an arrayed exposure apparatus, and the application of an arrayed cascaded microlens group. The preparation method comprises: applying a photoresist layer to a surface of a substrate; performing first underexposure in a first region, and performing second underexposure in a second region, wherein the first region and the second region have an overlapping portion but do not completely overlap, and the overlapping portion generates superimposed underexposure to form regional graded underexposure; performing development to form a regional photoresist pillar array; and transforming photoresist pillars into curved surfaces, and using the curved surfaces to perform patterned etching on the substrate to obtain an arrayed cascaded microlens group. The present application uses underexposure technology combined with regional superimposed exposure to directly perform regional exposure with different doses, ultimately preparing a wafer-level arrayed cascaded microlens group, and thus has the significant advantages of low cost, convenient operation, high preparation efficiency and high yield, and can be widely applied in the manufacturing processes of various imaging sensors, display devices and photovoltaic devices.

The invention discloses an edge exposure device and an exposure method, and belongs to the technical field of edge exposure. The edge exposure device comprises a feeding assembly, a feeding mechanism is arranged on the inner side of the feeding assembly, a turnover frame is arranged on the side position of the feeding assembly, and exposure frames are connected to the two sides of the top of the turnover frame; according to the invention, in the whole clamping, adsorption and pull-down process, a torque sensor, a first pressure sensor and a tension sensor are integrated in the system, so that the clamping, adsorption and pull-down processes of the two exposure frames are integrated, and the clamping, adsorption and pull-down processes of the two exposure frames are integrated; the multi-sensing-module cooperative monitoring mechanism can accurately control the clamping force, the pushing force and the downward pulling force acting on the glass substrate in real time, so that the problems of upward arching, downward sinking or unstable positioning of the glass substrate caused by improper stress are fundamentally avoided; and the safety and the shape integrity of the thin and brittle substrate in the processing process are greatly guaranteed.

The present disclosure provides a technique for achieving exposure by light having a high degree of matching with respect to sensitivity characteristics of an electrophotographic photoreceptor in an electrophotographic device. An exposure head (12) of an electrophotographic device (1) has light-emitting elements arranged side by side in a first direction (X). Each light-emitting element has a light-emitting layer containing semiconductor particles, which emit incoherent light, between layered electrodes, and the light-emission wavelength of the light-emitting layer is shorter than the light-emission wavelength represented by the band gap energy of the bulk of the semiconductor.

The invention discloses a high-precision circuit board line exposure positioning calibration device, and relates to the technical field of circuit board line exposure, the high-precision circuit board line exposure positioning calibration device comprises a frame body and an exposure module, a top frame is arranged on one side of the top of the frame body, and a calibration assembly used for assisting optical calibration is installed in the top frame; and the calibration assembly comprises a sliding base, a second servo motor, a first lead screw, a threaded block, a second lead screw and a third servo motor, the second servo motor is arranged in the sliding base, and the first lead screw is installed at the output end of the second servo motor. According to the high-precision circuit board line exposure positioning calibration equipment, through the design of the driving adjusting assembly, the positions of the two limiting assemblies can be conveniently exchanged through rotation, a user can conveniently carry out single-face or double-face exposure treatment on a circuit board according to the use requirement, the situation that the user needs to manually adjust the exposure face during double-face exposure is avoided, and when double-face exposure is carried out, the operation is convenient. Wherein one group of limiting assemblies can be synchronously realized when moving downwards to feed the to-be-exposed circuit board.

The invention discloses an exposure device, an exposure system and an exposure method thereof, and relates to the technical field of exposure. The exposure device comprises a rack, a driving mechanism, a light-transmitting plate, a liquid dropping mechanism and a bearing disc, the bearing disc is installed on the rack, the driving mechanism is connected with the light-transmitting plate, the liquid dropping mechanism is installed on the light-transmitting plate, the light-transmitting plate is provided with a receding groove, and the light-transmitting plate and the bearing disc are arranged in a spaced mode; the liquid dropping mechanism is used for enabling the refraction liquid to penetrate through the receding groove and drop onto the bearing disc, the bearing disc is used for bearing the glass sheet, the liquid dropping mechanism is further used for enabling the refraction liquid to penetrate through the receding groove and drop onto the glass sheet, and the driving mechanism is used for driving the light-transmitting plate to be pressed on the glass sheet. The exposure device provided by the invention can cancel a polishing process, is time-saving and labor-saving, shortens the exposure period, improves the exposure efficiency, reduces the exposure cost and improves the economic benefit.

Various embodiments herein relate to methods of using maskless lithography to form layers. In these embodiments, the method implements a dose-varying staircase that divides a geometry into overlay portions. The overlay portions can include different doses for each portion to achieve control of the taper. The taper can be achieved by operating the geometric "mask data" into different dose overlay portions controlled by a pixel blending (PB) exposure technique. To perform the methods described herein, a maskless lithography tool is used. The maskless lithography tool includes a controller that performs software-based "mask data" operations. Because the method is performed masklessly by software without the additional mask cost and manufacturing time, there is greater flexibility to adjust the taper angle and / or photoresist thickness residuals of multi-tone / grey-tone mask features, which is an advantage over traditional lithography methods that use masks.

The utility model discloses an exposure device for circuit board surface pattern manufacturing, and particularly relates to the technical field of circuit board surface pattern manufacturing exposure, which comprises a placing table, and a circuit board surface pattern manufacturing exposure auxiliary device is arranged at the upper end of the placing table. The circuit board surface pattern manufacturing exposure auxiliary device comprises an exposure assembly and a moving and transferring assembly. Compared with the prior art, the exposure device for manufacturing the surface pattern of the circuit board has the advantages that after the upper exposure machine body and the lower exposure machine body complete exposure of the circuit board, the upper exposure glass frame and the lower exposure glass frame continuously move to the upper end of the material placing table to wait for subsequent processing work of a worker; according to the device, the circuit board is subjected to fixed and movable exposure work through simple feeding and discharging, the feeding and discharging exposure efficiency of the whole device is greatly improved, meanwhile, the operation difficulty of the whole device is further reduced, and the applicability and the use stability of the whole device are effectively enhanced.

The utility model provides an exposure device and belongs to the technical field of exposure. The exposure device comprises a workbench, a plurality of marker lamp assemblies, a plurality of auxiliary lamp assemblies, a visual assembly and an exposure assembly. Wherein the workbench comprises a preset area for placing a workpiece to be exposed; the plurality of marker lamp assemblies are arranged in a preset area, and mark points are formed on the reverse side of the to-be-exposed workpiece when the front side of the to-be-exposed workpiece is exposed; the auxiliary lamp assemblies are all arranged outside the preset area, each auxiliary lamp assembly corresponds to the corresponding marking lamp assembly, and the visual assembly is used for identifying the marking lamps, the auxiliary lamps and the marking points and speculating the correction positions of the marking points according to the relation among the marking lamps, the auxiliary lamps and the marking points. And finally, exposing the reverse side of the to-be-exposed workpiece according to the corrected mark point through the exposure assembly. The exposure device disclosed by the utility model can ensure that the relative position relation of the exposure patterns on the front and back surfaces of the workpiece to be exposed is a determined value on the premise of not stopping the exposure work, so that the production efficiency is improved.

The utility model relates to the technical field of wafer exposure, and discloses a wafer exposure device which comprises a base, a support frame is fixedly arranged on the base, an exposure tube used for wafer P I exposure is fixedly arranged at the bottom of one end of the support frame, a wafer disc assembly used for fixing a wafer is arranged on the base, and the wafer disc assembly is fixedly arranged on the base. The exposure tube is sleeved with an exposure assembly used for performing secondary exposure on an invalid area at the edge of the wafer P I, and the exposure assembly is provided with a fixing assembly capable of fixing the exposure assembly at any position; by arranging the exposure assembly and the fixing assembly, after the wafer P I is subjected to overall exposure by using the exposure tube for the first time, the exposure assembly is slid and fixed by using the fixing assembly, and then the exposure assembly is started to perform secondary exposure on the invalid region of the edge of the wafer, so that the P I in the invalid region cannot be displayed by a developing solution, and the edge is kept flat; therefore, when the thick glue PR is coated, the thick glue can not enter a gap of the P I.

The invention provides an intelligent factory automatic assembly method and system based on a rapid exposure technology in the technical field of intelligent manufacturing. The method comprises the steps that S1, an upper computer sends an image acquisition instruction to an industrial camera based on an assembly instruction; s2, the industrial camera collects a part image through a rapid exposure technology based on the image collection instruction and carries out image preprocessing, image compression and image enhancement to obtain an optimized part image; s3, the industrial camera recognizes assembly position information and posture data from the optimized part image; s4, encrypting the optimized part image, the assembly position information and the attitude data into an encrypted image data packet, and sending the encrypted image data packet to an upper computer; and S5, the upper computer decrypts the encrypted image data packet to obtain the optimized part image, the assembly position information and the attitude data, and controls the industrial robot to execute assembly operation based on the assembly position information and the attitude data. The automatic assembling device has the advantages that the automatic assembling efficiency, reliability and economical efficiency are greatly improved.

The invention provides a 2D / 3D same-structure imaging system based on a time-sharing exposure technology, and the system comprises an image collection module, the image collection module is provided with a laser, a camera and a galvanometer, and the galvanometer is driven based on a moving magnet type motor, and is configured to obtain a laser line initial image of a measured object through a laser triangulation method; the image filtering module is configured to perform filtering processing on the laser line initial image based on a frequency domain Gaussian filtering approximation algorithm to obtain a laser line filtering image; the 2D / 3D same-phase imaging module is configured to perform time-sharing exposure processing on the laser line filtering image to obtain a texture image and a depth image respectively; the time-sharing exposure treatment comprises long-time exposure treatment and short-time exposure treatment; and the temperature compensation module is configured to perform temperature drift compensation on the laser and the galvanometer. By means of the system, the problems that in the existing three-dimensional imaging technology, point cloud data and texture information are not aligned, and the imaging precision is greatly affected by the environment are solved.

This utility model relates to the field of photolithography exposure technology and discloses a photolithography exposure layout positioning device, which solves the problems mentioned in the background art. It includes a chip placement stage, sliding components on both sides of the chip placement stage, photolithography exposure elements on the sliding components, and a fluid cooling pipe at the bottom of the chip placement stage. The fluid cooling pipe is laid along the chip placement stage and has an output end and an input end, both of which are connected to a cooling box. A pump body is provided at the connection between the cooling box and the input end. This utility model can significantly reduce the impact of thermal deformation on positioning accuracy, improve the stability of the exposure process, reduce equipment downtime and maintenance costs caused by thermal deformation, and maintain high-precision positioning.

The utility model relates to an inner layer alignment device applied to exposure equipment, and belongs to the technical field of inner layer plate exposure. Comprising a transparent front plate and a transparent back plate which are buckled with each other, alignment areas are arranged on the two sides of the front plate or the two sides of the back plate, and at least two targets are arranged on each alignment area; the targets are arranged on the upper side and the lower side of the alignment area, a plate to be exposed is fixed in an interlayer space between the front plate and the back plate, an area limited between the alignment areas on the two sides of the front plate or the back plate is a plate processing area, and the plate to be exposed is limited in the plate processing area. According to the device, accurate marking of the fourth point can be simply achieved, the alignment precision of the exposure plate can be effectively improved, meanwhile, the inner layer alignment device with a simple structure is adopted, and the device can effectively reduce the four-point alignment cost for exposure processing plates of different sizes.

The invention discloses an exposure machine and an exposure method thereof, and belongs to the technical field of exposure. The exposure machine comprises a base, a conveying mechanism, a feeding mechanism, a cleaning mechanism, an exposure mechanism and a discharging mechanism, and the conveying mechanism is movably arranged on the base and can transfer an object from a feeding area to a discharging area through an exposure area; the feeding mechanism is arranged in the feeding area of the base and can store an object to be exposed and place the object to be exposed on the conveying mechanism. The cleaning mechanism is arranged in the feeding area of the base or located between the feeding area and the exposure area and can clean the surface of an object to be exposed. The exposure mechanism is arranged in the exposure area of the base and can perform exposure treatment on the to-be-exposed object in the exposure area; the discharging mechanism is arranged in the discharging area of the base and can pick up the exposed objects from the conveying mechanism and store the exposed objects in a classified mode. The exposure machine integrates the functions of automatic feeding and discharging, automatic cleaning and the like, and can remarkably improve the production efficiency and the exposure quality.

The application discloses a sub-resolution auxiliary pattern exposure model training method and related devices, applied to the technical field of auxiliary pattern exposure, comprising obtaining a printed image formed after sub-resolution auxiliary pattern exposure and extracting a printed contour; the printed contour retains a contour corresponding to the sub-resolution auxiliary pattern; the printed image is grid divided, and a grid is formed on the printed image; a correction scale is arranged in each grid; an area proportion covered by the auxiliary pattern printed contour in each grid is determined based on the correction scale; an initial model is trained with the area proportion as an input value to obtain an exposure model. By dividing the grid in the printed image, the area proportion of the auxiliary pattern printed contour in each grid is calculated, the area proportion is not binary data, and the printed degree of the sub-resolution auxiliary pattern can be accurately represented. The initial model is trained by the area proportion, so that the exposure model after training has higher accuracy.

A method and a device for compensating a surface error of a holographic grating substrate based on scanning and exposure technology relates to a technical field of grating development. The method and the device adopt surface error compensation technology based on phase modulation of interference fringes of a scanning beam interference lithography system. The method and the device solve a poor grating diffraction wavefront quality caused by a surface processing error in a field of holographic grating research and improves full-aperture diffraction wavefront quality of a grating. Through coordination between feedback of the displacement measurement apparatus for the position of the two-dimensional worktop and the modulation of the scanning beam interference lithography system, full-aperture compensation of the surface error of the holographic grating substrate is achieved, which not only reduces processing accuracy requirements for the holographic grating substrate, but also improves the full-aperture diffraction wavefront quality of the grating.

The utility model discloses a high-brightness exposure mechanism of an automatic exposure machine, and particularly relates to the technical field of high-brightness exposure, which comprises a support base, a mounting support block is arranged on one side of the lower end of the support base, an annular mounting groove is arranged in the middle of the upper end of the support base, and a mounting lug is arranged at the upper end of the support base and on the outer side of the annular mounting groove. A heat conduction supporting block is arranged in the annular mounting groove, heat dissipation fins are arranged in the middle of the lower end of the heat conduction supporting block, and a sealing mounting cylinder is arranged on the outer side of the upper end of the mounting protruding block. When the LED lamp is actually used, heat dissipation work can be conveniently carried out on the LED circuit board in the state that the annular mounting groove, the heat conduction supporting block, the LED circuit board and the heat dissipation fins are correspondingly arranged, and therefore the working environment of the LED circuit board is guaranteed, and meanwhile the heat dissipation work can be conveniently carried out on the LED circuit board in the state that the reflection cylinder and the supporting square spring are correspondingly arranged. And after the sealing mounting cylinder and the sealing top cover are mounted, the reflecting cylinder and the supporting square spring can be driven to press downwards.

The application discloses a kind of based on hydrogel direct printing platform and the method for realizing optical image information security, the hydrogel direct printing platform is composed of metal-polyvinyl alcohol-metal three-layer film, using electron beam exposure technology, can directly print out ladder type hydrogel nanometer microcavity, for the generation of structural color;The polyvinyl alcohol layer as a typical hydrogel, can absorb water molecules and swell behavior;The method for realizing optical image information security includes: one-time optical information transmission and optical image hiding.By electron beam exposure technology on hydrogel nanometer microcavity prints out optical image information, when information transmission is completed, can utilize environmental humidity change and destroy information instantly, reach one-time optical information transmission.Further, using relative humidity brings the structural color change of ladder type nanometer microcavity, can realize optical image hiding and decryption.The application can be applied to optical information security, encryption and anti-counterfeiting and the like field.

The utility model discloses a large table-board laser direct imaging exposure device of a printed circuit board, which relates to the technical field of large table-board laser direct imaging exposure of the printed circuit board and comprises a fixed seat, an L-shaped frame is fixedly connected to the middle of the top end of the fixed seat, and an automatic adjusting assembly is fixedly connected to the top end of the inner wall of the L-shaped frame. Sliding strips are fixedly connected to the two sides of the inner bottom wall of the L-shaped frame, a fixing assembly is slidably connected to the inner walls of the sliding strips, the automatic adjusting assembly comprises a fixing frame fixedly connected to the top end of the inner wall of the L-shaped frame, and fixing blocks are fixedly connected to the two sides of the top end of the fixing frame; through the arrangement of the automatic adjusting assembly, when a worker operates the device for use, the servo motor drives the transmission rod and the threaded rod to rotate and drives the sliding block and the sliding plate to linearly move, so that the position of the laser direct imaging exposure machine body can be quickly and accurately adjusted, and the exposure requirements of printed circuit boards with different sizes are met; and the exposure efficiency and precision are greatly improved.

The present application relates to the technical field of exposure, in particular to a quality detection method and a parameter adjustment method based on a microlens array (MLA) exposure process. The quality detection method comprises the following steps: establishing an exposure pattern detection model capable of identifying the category of each exposure point pattern; the pattern category includes qualified patterns and unqualified patterns; setting initial exposure parameters and obtaining an exposure image obtained through the MLA exposure process; inputting the exposure image into the exposure pattern detection model to generate a data information set corresponding to the pattern category of each exposure point; determining the pattern category of the exposure point according to the data information set and counting the number of exposure points of the qualified patterns and the unqualified patterns in the exposure image to obtain the proportion of the number of exposure points of the qualified patterns to the total number of exposure points. Through the above setting, the qualified patterns and the unqualified patterns can be automatically identified, so that the qualified rate of the MLA exposure quality can be automatically obtained, and the quality detection precision and speed are effectively improved.

The invention relates to the technical field of interference exposure, and provides an interference exposure device which comprises a light beam generation unit, a light splitting unit, a working plane and reflection units corresponding to a first light beam and a second light beam. The reflecting unit comprises a reflecting mirror and an adjusting unit, and the incident angles of the two beams of light on the working plane are accurately controlled by adjusting the position of the reflecting mirror, so that the interference included angle and the fringe period can be adjusted, and rapid switching of micro-nano structures of different periods is realized. The reflective optical path is beneficial to maintaining wavefront continuity and interference stability, is matched with precise adjustment to improve alignment precision, repeatability and exposure reproducibility, is convenient to integrate with modules such as light intensity matching and polarization control, and improves process universality and preparation flexibility.

The invention discloses a parallel processing and relay exposure LDI laser direct imaging exposure method and system, and relates to the technical field of photoetching equipment and laser direct imaging exposure, and the method comprises the following steps: collecting layout graphic data, calibrating multiple exposure head coordinates, and generating exposure coordinate reference data according to a calibration result; performing adaptive slicing according to the exposure coordinate reference data, and generating a slice boundary relay overlapping band and a task queue; and distributing the slices to a plurality of exposure heads for parallel exposure according to the task queue, generating an exposure context snapshot in a relay overlapping band, and reading the context snapshot by a connecting rod head for continuous exposure. The method disclosed by the invention has better effects in the aspects of continuity of parallel exposure scheduling, controllability of cross-slice connection and coordinate consistency of multiple exposure heads.

The invention discloses a pixel exposure adjustment method and system, and relates to the technical field of pixel exposure. The method comprises the following steps: acquiring a pixel array of an original image; determining an exposure mode as a single-frame multi-segment exposure mode according to the pixel array and actual requirements; performing single-frame multiple exposure parameter initialization, and adjusting the exposure parameters based on a single-frame multi-segment exposure parameter adjustment method according to the initialized exposure parameters to obtain adjusted exposure parameters; the exposure parameters comprise exposure time and gain; and performing corresponding exposure control on each region of the pixel array based on the single-frame multi-section exposure mode and the adjusted exposure parameters. Compared with an existing scheme, the speed can be increased by two times or more, and the exposure efficiency in a low-power-consumption system is greatly improved.

The application provides an etching deviation acquisition method of a multiple exposure technology, and the method comprises the following steps: providing a first mask and a second mask, wherein the first mask comprises a first pattern and a second pattern, the second mask comprises a third pattern, and the second pattern and the third pattern are superimposed to form a fourth pattern; acquiring a simulated post-development line end spacing of the first pattern and the fourth pattern; performing a first photolithography process to acquire a post-development line end spacing of the first pattern; performing a second photolithography process, wherein the third pattern and the second pattern are superimposed to form a fourth pattern on the wafer, and an etched line end spacing of the fourth pattern is acquired; and acquiring an etching deviation based on the simulated post-development line end spacing of the first pattern and the fourth pattern, the post-development line end spacing of the first pattern and the etched line end spacing of the fourth pattern. The technical scheme of the application can make the etching deviation of the line end spacing more accurate in the length direction.

The application relates to the field of photoetching technology, and discloses a precision optimization method and system of a roll-to-roll high-precision projection exposure machine, the method comprising the following steps: acquiring microscopic depth data, material vibration data and an exposure overlapping area; performing energy distribution analysis according to the microscopic depth data to obtain exposure energy distribution; performing frequency domain analysis according to the material vibration data to obtain vibration frequency domain characteristics; performing correlation calculation according to the exposure energy distribution and the vibration frequency domain characteristics to obtain a correlation influence matrix; performing energy accumulation analysis on the exposure overlapping area to obtain an overlapping correction factor; and performing exposure parameter optimization according to the overlapping correction factor and the correlation influence matrix to update exposure machine control parameters. The method has the following effects: the method can improve the working precision of the roll-to-roll projection exposure machine.

In imaging systems, automatic exposure (AE) control adjusts scene exposure to place the subject of interest in an image, such as a human face, within a predefined brightness range. Single-exposure AE techniques may struggle to simultaneously lift dark subjects and preserve highlight details, especially in high dynamic range or backlit scenes. An effective AE control technique can compute a target brightness for the subject in a manner that is tone-mapping-aware and noise-aware. The target brightness can be used to derive an exposure setting for the image. The result is comparable to pipelines relying on fusing multiple exposures. The technique lifts dark subjects to a target brightness while preserving highlight detail, providing an efficient and practical solution for real-time imaging on single-exposure sensors.