Sticking device for flat panel substrate

Abstract

The present invention provides a sticking device for flat panel substrate so that two substrates can be smoothly moved for alignment from the outside in XYtheta direction in vacuum without using an XYtheta stage. In the present invention, both holding plates (1, 2) are adjustably moved relative to each other in XYtheta directions by a positioning moving means (8) disposed on the outside of a closed space (S) while maintaining the closed space (S) in vacuum state by maintaining the clearances between the peripheral edge parts (1a, 2a) of both holding plates (1, 2) in the sealed state by moving seal means (4), so that the positioning adjustment means (5) are moved in the same directional to position both substrates (A, B) relative to each other, and that the clearance between the peripheral edge parts (1a, 2a) of both holding plates (1, 2) is held at a specified clearance by the large rigidity of the positioning adjusting means (5) in Z direction, whereby a support resistance applied to the moving seal means (4) can be maintained at a proper value.

Description

technical field [0001] The present invention relates to a flat panel for aligning (aligning) and bonding two substrates used in the flat panel display such as a liquid crystal display (LCD) or a plasma display (PDP) during the manufacturing process of the flat panel display (PDP). Bonding equipment for substrates for panels. [0002] Specifically, in the bonding apparatus for substrates for planar plates according to the present invention, two substrates that are detachably held on a pair of upper and lower holding plates are stacked in a vacuum so that they are opposed to each other in the XYθ direction. The adjustment and movement of the substrates are carried out to align the substrates, and the pressure difference between the inside and outside of the two substrates is used to press the two substrates tightly to the specified gap. Background technique [0003] Conventionally, as such a bonding apparatus for a substrate for a planar plate, for example, refer to Japanese ...

AI Technical Summary

Problems solved by technology

[0007] However, this existing bonding device for planar substrates uses an XYθ stage as an alignment mechanism between the two substrates. The existing XYθ stage basically moves in the XYθ direction in units greater than or equal to mm However, for the design, especially the amount of movement of only a few hundred μm or less such as the alignment of the substrate is less than the amount of rotation of the rotating body of the rolling bearing. When the movement amount of only a few hundred μm or less is repeated each time Insufficient lubrication will cause wear on the sliding part during the alignment of the substrate, which will cause a problem of poor durability.

[0008] In addition, the enclosed space formed on the above-mentioned XYθ table must be heavy in order to obtain a structure that can withstand the specified vacuum degree. This will also cause the sliding part of the XYθ table to be easily worn. In order to prevent this, it is necessary to carry out frequent inspections. maintenance work problem

[0009] In addition, in terms of the structure of the XYθ table, since the overall size and weight of the device increases, there is a problem that the manufacturing cost and the transportation cost increase.

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