Laser circular cutting punching method and its device
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- 武汉工研光学科学技术股份有限公司
- Publication Date
- 2005-08-03
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
Technical field
[0001] The invention relates to laser drilling technology, in particular to a laser ring cutting and drilling method and its device, which are used for micro-hole processing of thin plates. Background technique
[0002] The application of laser drilling technology to micro-hole processing of thin plates has a long history. However, the development of this technology has been relatively slow in recent years, and the difficulty of controlling the processing aperture is one of its main technical difficulties. This is because: the transmission of the laser is carried out in a cylindrical shape in the space contained by its divergence angle, and the cross section perpendicular to the propagation direction of the laser beam is a solid circular spot, and its energy is distributed in the area of the solid circle , The laser beam is focused by the imaging lens and converges in a conical shape, forming a focal point at the intersection. If the blasti...