Testing apparatus and testing method for printable property of soldering paste

A test device and printability technology, applied in the direction of measuring devices, mechanical devices, instruments, etc., can solve the problems of rough measurement methods, low precision, and reduced solder paste rolling ability, and achieve the effect of fast printability of solder paste
CN1673718AInactive Publication Date: 2005-09-28吴懿平
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
吴懿平
Publication Date
2005-09-28
Estimated Expiration
Not applicable · inactive patent

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Abstract

The present invention is soldering paste printability test apparatus and method. The test apparatus includes scraper loading part comprising spring, press rod rack, scraper holder, scraper, etc.; ring temperature rotating part comprising scraper blocking ring, ring template, turntable, spindle, DC reducing motor, etc; control and test part comprising atmosphere temperature and humidity controlling box, micro strain sheet, micro mechanical sensor, video camera, etc; and computer as the peripheral equipment. The test method includes using printing unit of scraper-ring structure in printing soldering paste continuously in different temperature and humidity, and monitoring soldering paste rolling state change with video camera, micro strain sheet and micro mechanical sensor to evaluate the printability of soldering paste.
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Description

technical field

[0001] The invention relates to a device and method for testing the printability of solder paste, which is specially used for measuring the printing performance of solder paste and other materials printed by stencil printing or screen printing, such as conductive glue and printing ink. Background technique

[0002] So far, in the assembly and production of electronic boards, the most commonly used is surface mount technology. It uses solder paste as the connection material, applies the solder paste to the pads to be soldered on the printed circuit board by stencil printing or drip coating, and then mounts the components, and finally the soldered parts can be obtained through the reflow process. board.

[0003] Since the stencil printing process of solder paste is very simple and has high production efficiency, it has become a mainstream technology. The specific method is: first place the flat template with the leakage hole on the pr...

Claims

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