A method for preparing an anti-adhesion film for photocuring continuous surface molding 3D printing

A 3D printing and anti-adhesion technology, applied in the field of 3D printing, can solve the problems of high price, high equipment requirements, and oxygen consumption
CN110256724BActive Publication Date: 2021-04-20XI AN JIAOTONG UNIV
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Patent Information

Authority / Receiving Office
CN ยท China
Patent Type
Patents(China)
Current Assignee / Owner
XI AN JIAOTONG UNIV
Publication Date
2021-04-20

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Abstract

A method for preparing an anti-adhesion film for photocuring continuous surface molding 3D printing. Soak the fluorinated porous material that is transparent to ultraviolet light in a fluorinated liquid or fluorine-containing nano-scale lubricating oil, and after a period of time, the fluorinated liquid or fluorine-containing nano-scale lubricating oil can fully infiltrate the interior of the porous material, and then Use organic solvents to remove excess fluorinated liquid or fluorine-containing nano-scale lubricating oil. Using the chemical compatibility of the porous material and the oleophobic phase and the capillary action of the porous material, a stable micron-sized liquid film is formed on the surface of the porous material, and the "solid bond" between the molded part and the light-transmitting porous film material "Transform into a "solid-liquid bond" between the molded part and the liquid oleophobic phase, separate the molded part from the porous material, reduce the adhesion between them, so that the printing process can be carried out continuously, the preparation method is low cost and simple fast.
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Description

technical field

[0001] The invention belongs to the technical field of 3D printing, and in particular relates to a method for preparing an anti-adhesion film used for photocuring continuous surface forming 3D printing. Background technique

[0002] Stereo lithography apparatus (SLA) is the earliest developed and currently one of the more mature additive manufacturing technologies. After years of development, the traditional light-curing rapid prototyping technology has transitioned from the "point-to-line, line-to-surface, surface-to-body" SLA molding method to the current "surface-to-body" DLP molding method directly. The cohesion between the films is relatively large, which limits the molding speed and precision of DLP. In recent years, the "continuous liquid interface manufacturing technology" (CLIP) developed by Carbon3D in the United States uses the principle of oxygen inhibition to make a certain thickness of uncured liquid resin between the resin and the molded part,...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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