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Method and device for producing a primary individual packing of a wafer

A basic unit and dry film technology, which is applied in the field of manufacturing dry film basic unit packaging, and can solve problems such as changes in the amount of active substances

Inactive Publication Date: 2005-10-12
LTS LOHMANN THERAPIE-SYST AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the area of ​​the wafer is decisive for the dosing of the active substance, there is a risk that the amount of active substance in the individual wafers will vary

Method used

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  • Method and device for producing a primary individual packing of a wafer
  • Method and device for producing a primary individual packing of a wafer
  • Method and device for producing a primary individual packing of a wafer

Examples

Experimental program
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Embodiment Construction

[0040] figure 1 The device shown has on its inlet side a supply reel 1 for a stack 4 consisting of a carrier sheet 2 and an active material film 3 which is drawn forward; 3 a peeling device 6 for separating the carrier sheet 2; and a reel 8 for winding the carrier sheet 2. Guide grooves or guide bars 9 are installed below the separation roller 7 to allow precise alignment of the separated active substance film 3 from the carrier sheet 2, as well as a cross-cutting device 10 equipped with a blade (not shown), and for the two packaging materials Foil 12 feeding and pulling packaging material device 11, device 11 has on the cutting device side a receiving and clamping device consisting of two pairs of nip rollers 13 and 14 arranged as a pair of nip rollers on the other side. over a pair of nip rollers. The packaging material sheet 12 is placed on the feed roller 15 and is guided to the pulling roller 16 by the nip rollers 13 and 14. In this way, the packaging material sheet 12 is...

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PUM

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Abstract

The invention relates to a method and device for producing a primary individual packing of a wafer according to which a laminate consisting of a carrier foil and of an active substance film is cross-cut with a predetermined length and detached from the carrier foil, is guided between two packaging material webs and, together with these webs, is fed to a sealing station. The packaging webs are sealed to form a packet, after which this packet is detached from the packaging material webs. The invention solves the task of providing a method and device which ensure that the wafer material is not subjected to mechanical stress. The inventive method provides that the carrier foil (2) detached from the active substance film (3) is pulled forward to the predetermined length of the wafer (21), and the active substance film (3) detached therefrom is simultaneously guided with its front end between the stationary packaging material webs (12) without being subjected to mechanical stress, is held and fixed by these packaging material webs, and is cross-cut with the predetermined length at a distance from the webs to form a wafer (21). Afterwards, the wafer (21) is pulled forward together with the packaging substance webs (12) in a synchronous manner and is fed to the sealing station (17 / 18). To this end, the device is provided with a packaging material feeding and pulling device (11) having a holding and clamping device (13 / 14), which is provided for holding and clamping the front end of the active substance film (3) and which, in a vertical direction, is mounted underneath the separating roll (7) and the cross-cutting tool (10).

Description

technical field [0001] The present invention relates to a method and apparatus for the manufacture of wafer basic unit packages, in particular wafers for dosage units and administration forms for pharmaceuticals, separated from an active substance film of one or more active substances. Background technique [0002] In addition to the well-known pharmaceutical dosage forms such as tablets, capsules, drops or similar administration methods, there is also a "chip" administration dosage form. This is a small flake of active substance film containing a predetermined amount of active substance and having a thickness and dimensions suitable for the amount of active substance administered. Wafers are flexible, soft, lightweight, and tearable. Since the wafer contact surface and active substance dose are directly related, the wafer size must be equal to the maximum possible extent of the calculated size and must be within a tolerable range. Since the dosage depends on the surface a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65D75/00A61J1/03B65B9/02B65B61/00
CPCB65B9/02B65B61/00
Inventor 沃尔夫冈·撒弗尔罗纳尔德·海克贝斯汉斯-迪特尔·扎姆
Owner LTS LOHMANN THERAPIE-SYST AG