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Semiconductor apparatus and method for fabricating the same

a technology of semiconductor devices and solder balls, which is applied in the direction of electrical apparatus, semiconductor devices, semiconductor/solid-state device details, etc., can solve the problems of difficulty in visually recognizing the solderbility or wetting condition of solder balls

Inactive Publication Date: 2002-05-23
LAPIS SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0007] Accordingly, an object of the present invention is to provide a semiconductor apparatus in which solderbility or wetting condition can be visually and easily inspected.
[0008] Another object of the present invention is to provide a method for fabricating a semiconductor apparatus in which solderbility or wetting condition can be visually and easily inspected.

Problems solved by technology

As a result, it is difficult to visually recognize the solderbility or wetting condition of the solder balls.

Method used

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  • Semiconductor apparatus and method for fabricating the same
  • Semiconductor apparatus and method for fabricating the same
  • Semiconductor apparatus and method for fabricating the same

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Embodiment Construction

[0039] In the following detailed description of the preferred embodiments, reference is made to the accompanying drawings which forma part hereof, and in which is shown by way of illustration specific preferred embodiments in which the inventions may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention, and it is to be understood that other embodiments may be utilized and that logical, mechanical and electrical changes may be made without departing from the spirit and scope of the present inventions The following detailed description is, therefore, not to be taken in a limiting sense, and scope of the present inventions is defined only by the appended claims.

[0040] For better understanding of the present invention, a conventional technology is first described in conjunction with FIGS. 1 and 2. FIG. 1 is a cross-sectional view showing a part of a conventional semiconductor apparatus. FIG. 2 is a cross sectiona...

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Abstract

A semiconductor apparatus includes a semiconductor device to be mounted on a circuit board; a plurality of conductive posts electrically connected to the semiconductor device; and a plurality of conductive bumps each provided on an outer end of each of the conductive posts, so that the plurality of conductive bump is soldered onto the circuit board when the semiconductor device is mounted on the circuit board. A distance between a peripheral edge of the semiconductor device and an outer edge of the conductive post is determined to be narrow so that a solderbility or wetting condition of the conductive bumps can be visibly recognized easily.

Description

CROSS REFERENCE To RELATED APPLICATION[0001] This application claims the priority of Application No. 2000-128764, filed Apr. 28, 2000 in Japan, the subject matter of which is incorporated herein by reference.[0002] The present invention relates to a semiconductor apparatus, and more particularly, to a resin-molded semiconductor apparatus and method for fabricating the same.[0003] Recent years, in connection with the rapid spread of potable apparatus, semiconductor apparatus mounted therein is required to be thinner, smaller and lighter. In order to fill this demand, a large number of inventions have been made.[0004] In fabrication of a conventional semiconductor apparatus, a rewiring pattern, which is made of copper (Cu), is electrically connected to electrode pads of a semiconductor device (semiconductor element). The rewiring pattern is connected to conductive posts, which are made of copper (Cu). The semiconductor device is molded with a resin so that the molding resin has an upp...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H01L21/56H01L23/12H01L23/31H01L23/485H01L23/28H01L23/498
CPCH01L21/563H01L2224/0401H01L23/49838H01L24/11H01L24/28H01L24/94H01L2224/0231H01L2224/131H01L2224/274H01L2224/73203H01L2924/01004H01L2924/01013H01L2924/01027H01L2924/01029H01L2924/0103H01L2924/01039H01L2924/0105H01L2924/01082H01L2924/10157H01L23/3185H01L2224/16227H01L2224/13027H01L2224/16225H01L24/13H01L2924/00013H01L2924/01005H01L2924/01006H01L2924/01033H01L2924/014H01L2224/05553H01L2224/13099H01L2924/181H01L2924/12042H01L2224/171H01L2224/1412H01L2224/05124H01L2224/05147H01L2224/05647H01L2224/02379H01L2224/06135H01L24/05H01L2924/00H01L2924/00012H01L2924/00014
Inventor OHUCHI, SHINJISHIRAISHI, YASUSHITANAKA, YASUO
Owner LAPIS SEMICON CO LTD