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Plate material cutting method, printed circuit board, and electronic device

a technology of printed circuit board and cutting method, which is applied in the direction of printed circuit, printed circuit, printed circuit manufacturing, etc., can solve problems such as unsuitable application

Inactive Publication Date: 2007-04-05
KK TOSHIBA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0003] One embodiment of the invention relates to a plate material cutting method, a printed circuit board, and an electronic device. For example, one embodiment of the invention relates to (i) a plate material cutting method which is used for cutting a plate material to obtain a member, and (ii) a printed circuit board and an electronic device provided with a member which is cut out from the plate material.
[0003] One embodiment of the invention relates to a plate material cutting method, a printed circuit board, and an electronic device. For example, one embodiment of the invention relates to (i) a plate material cutting method which is used for cutting a plate material to obtain a member, and (ii) a printed circuit board and an electronic device provided with a member which is cut out from the plate material.

Problems solved by technology

However, if the joining member is too light in weight, it does not fall from the die assembly and may adhere to the surface of the punch, die or blank holder.
The blade cutter may be useful where portions to be cut is disposed in line, but is not advantageously applied to the case where a plurality of joining members extend in various directions.

Method used

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  • Plate material cutting method, printed circuit board, and electronic device
  • Plate material cutting method, printed circuit board, and electronic device
  • Plate material cutting method, printed circuit board, and electronic device

Examples

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first embodiment

[0032]FIGS. 1-10 show a cellular phone, which is an example of an electronic device according to the present invention. As shown in FIG. 1, the cellular phone 1 includes a main body 2, a display unit 3 and a hinge portion 4.

[0033] The main body 2 includes a box-like casing 5. The casing has an upper wall on which a plurality of push-type operation keys 6 are arranged. The casing 5 contains a main board 7 and an HDD 8. The display unit 3 includes a display housing 9 and a liquid crystal display module 10 received inside the display housing 9. The liquid crystal display module 10 has a display screen 10a. The display screen 10a is exposed to the outside of the display housing 9 though an opening section 9a of the display housing 9. The display unit 3 is supported by the rear end portion of the main body 2 by means of the hinge portion 4.

[0034] The HDD 8 received in the casing 5 of the main body 2 is an example of a disk drive, which is one type of electronic device. As shown in FIG. ...

second embodiment

[0082] The printed wiring board 31 obtained by the die assembly 61 and plate material cutting method according to the present invention is incorporated in the cellular phone 1 or HDD 8.

[0083] The above-mentioned plate material cutting method and the die assembly 61 are advantageous in that the printed wiring board 31 can be separated from the throw-out portion 36 without producing cutting chips. For the same reason as stated in connection with the first embodiment, when the punch 63 is pushed against the throw-out portion 36, the joining member 37 is cut off from the printed wiring board 31 but remains connected to the throw-out portion 36. Therefore, the joining member 37 does not produce any cutting chips.

[0084] The punch 63 of the second embodiment has a circular cross section. The joining member 37 of the metallic plate 34 is very small, and its longitudinal dimension is several mm or less. Therefore, the punch 63 is also very small in size and cannot be made with ease unless i...

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Abstract

According to one embodiment, a plate material cutting method prepares a plate material including a joining member that joins a main body portion to a throw-out portion, sets the plate material on a die including an opening section, and pushes a punch against the joining member. The punch includes a first end portion corresponding to a first end of the joining member which is connected to the main body portion. The punch also includes a second end portion corresponding to a second end of the joining member which is connected to the throw-out portion. A gap smaller than thickness of the plate material is defined between the first end portion of the punch and an inner surface of the opening section. A gap larger than the thickness of the plate material is defined between the second end portion of the punch and the inner surface of the opening section.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2005-288005, filed Sep. 30, 2005, the entire contents of which are incorporated herein by reference.BACKGROUND [0002] 1. Field [0003] One embodiment of the invention relates to a plate material cutting method, a printed circuit board, and an electronic device. For example, one embodiment of the invention relates to (i) a plate material cutting method which is used for cutting a plate material to obtain a member, and (ii) a printed circuit board and an electronic device provided with a member which is cut out from the plate material. [0004] 2. Description of the Related Art [0005] An electronic device such as a hard disk drive (hereinafter referred to as HDD) is provided with a printed circuit board. The printed circuit board can be prepared in a variety of methods. For example, a thin circuit board such as a flexible printed circuit bo...

Claims

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Application Information

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IPC IPC(8): B21D31/00
CPCB21D28/10H05K1/0393H05K3/005H05K3/0052H05K2201/09063H05K2201/0909
Inventor AOKI, MAKOTO
Owner KK TOSHIBA